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I applied via Walk-in and was interviewed in Jun 2024. There was 1 interview round.
The combination of solder paste in SMT line typically consists of flux, solder powder, and other additives.
Flux is used to clean and prepare the surfaces to be soldered.
Solder powder is the main component that forms the solder joint.
Additives may include thickeners, activators, and other materials to improve the soldering process.
Example: A common combination is 60% solder powder, 35% flux, and 5% additives.
The tolerance of SPI (Serial Peripheral Interface) is typically specified by the manufacturer and can vary depending on the specific device.
SPI tolerance is usually specified in terms of clock frequency, voltage levels, and timing requirements.
Different SPI devices may have different tolerance levels, so it is important to refer to the datasheet for accurate information.
For example, a certain SPI device may have a cloc...
I applied via Walk-in and was interviewed in Nov 2023. There was 1 interview round.
I applied via Walk-in and was interviewed in Oct 2023. There were 3 interview rounds.
Basic questions and technical questions.
Foxconn interview questions for designations
I applied via Walk-in and was interviewed in Oct 2023. There was 1 interview round.
I applied via Other and was interviewed before Oct 2019. There were 3 interview rounds.
I applied via Walk-in and was interviewed before Sep 2021. There were 3 interview rounds.
Written test was easy to medium
I applied via NATS and was interviewed before Jun 2021. There was 1 interview round.
I applied via Walk-in and was interviewed in Nov 2023. There were 3 interview rounds.
I have over 10 years of experience in various technical roles, including software development, system architecture, and project management.
10+ years of experience in technical roles
Strong background in software development
Experience in system architecture and project management
I applied via Referral and was interviewed before May 2020. There were 4 interview rounds.
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