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Bosch Packaging Technology Interview Questions and Answers

Updated 19 Jul 2024

Bosch Packaging Technology Interview Experiences

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Senior Engineer Interview Questions & Answers

user image Thejashwini Sridhar

posted on 19 Jul 2024

Interview experience
4
Good
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Technical 

(2 Questions)

  • Q1. Java collections
  • Q2. Spring boot and angular

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I applied via Campus Placement and was interviewed before Nov 2020. There were 4 interview rounds.

Interview Questionnaire 

10 Questions

  • Q1. Write a program to sort an array of numbers
  • Ans. 

    Program to sort an array of numbers

    • Use a sorting algorithm like bubble sort, insertion sort, or quicksort

    • Loop through the array and compare adjacent elements to swap them if necessary

    • Repeat until the array is sorted in ascending or descending order

  • Answered by AI
  • Q2. Write a program to swap two numbers
  • Ans. 

    A program to swap two numbers

    • Declare two variables and assign values to them

    • Use a third variable to store the value of the first variable

    • Assign the value of the second variable to the first variable

    • Assign the value of the third variable to the second variable

  • Answered by AI
  • Q3. Pointers, pass by value and pass by reference
  • Q4. Draw and explain D flop truth table
  • Ans. 

    D flip-flop is a digital circuit that stores a single bit of data and transfers it to the output on the rising edge of the clock signal.

    • D flip-flop has a single data input (D) and two outputs (Q and Q').

    • The truth table for D flip-flop is: D Q(t) Q(t+1), 0 0 0, 1 1 1.

    • The D input is sampled on the rising edge of the clock signal and transferred to the output.

    • The Q output is the complement of the Q' output.

    • D flip-flop is ...

  • Answered by AI
  • Q5. Difference between big endian and small endian
  • Ans. 

    Big endian and small endian are two ways of storing multi-byte data in computer memory.

    • Big endian stores the most significant byte first and the least significant byte last.

    • Small endian stores the least significant byte first and the most significant byte last.

    • The choice of endianess affects how data is interpreted and communicated between different systems.

    • For example, the IP protocol uses big endian for its header fi...

  • Answered by AI
  • Q6. What is bootloader
  • Ans. 

    Bootloader is a program that loads and starts the operating system when a computer is turned on.

    • Bootloader is the first program that runs when a computer is turned on.

    • It is responsible for loading and executing the operating system.

    • Bootloader is usually stored in the computer's firmware or on the hard drive.

    • It performs hardware checks and initializes the system before loading the OS.

    • Examples of bootloaders include GRUB

  • Answered by AI
  • Q7. Few questions on projects that I have worked on
  • Q8. Why C is preferred over python in embedded systems
  • Ans. 

    C is preferred over Python in embedded systems due to its low-level control and efficiency.

    • C allows for direct memory manipulation and low-level hardware access, which is necessary in embedded systems.

    • Python, on the other hand, is a high-level language that requires an interpreter, making it less efficient and slower than C.

    • C also has a smaller memory footprint and can be optimized for specific hardware, making it idea...

  • Answered by AI
  • Q9. Difference between microcontroller and micro processor
  • Ans. 

    Microcontroller is a self-contained system with memory, input/output peripherals and a processor. Microprocessor only has a processor.

    • Microcontroller has on-chip memory and peripherals while microprocessor requires external memory and peripherals

    • Microcontroller is used in embedded systems while microprocessor is used in personal computers

    • Microcontroller is cheaper and consumes less power than microprocessor

    • Examples of ...

  • Answered by AI
  • Q10. Few more basic questions on microcontroller architecture in general

Interview Preparation Tips

Interview preparation tips for other job seekers - I had applied for the company based on campus interview
First round was a online test conducted in campus. Aptitude, basic electronics both analog and digital, c programming questions were there
Next round was based on simple programing questions, basic electronics , microcontrollers and OS
HR round was very basic with few typical HR questions.
I would recommend to join this company as a lateral than fresher. You don't get to know the dept and role beforehand. If the HR don't map your skill well you might end up in a role which you dont like unlike lateral

Skills evaluated in this interview

I applied via Naukri.com and was interviewed before Jun 2020. There were 5 interview rounds.

Interview Questionnaire 

1 Question

  • Q1. Question were on c and Linux mainly , basic understanding of concepts OS level TCP and UDP protocol.

Interview Preparation Tips

Interview preparation tips for other job seekers - Basics should be strong enough they check that
Eagerness to learn new things expected from interviewing
Brush up on the skills set what you have
Don't just go without preparation
Ask for onsite opportunity
Ask for work culture

I applied via Naukri.com and was interviewed in Apr 2021. There were 3 interview rounds.

Interview Questionnaire 

2 Questions

  • Q1. Related to job profile, autosar, c programming
  • Q2. Autosar stacks

Interview Preparation Tips

Interview preparation tips for other job seekers - Go through the job profile

I applied via Walk-in and was interviewed in Jan 2020. There were 3 interview rounds.

Interview Questionnaire 

1 Question

  • Q1. Embedded C, Communication Protocol and project related questions

Interview Preparation Tips

Interview preparation tips for other job seekers - Keep updating on Naukri before 10am of every day and be ready to answer any technical questions which u have updated in your profile.

I applied via Naukri.com and was interviewed before Apr 2020. There were 3 interview rounds.

Interview Questionnaire 

1 Question

  • Q1. Basic questions on C language,CAN,LIN protocol questions, questions on the project which I was working on.

Interview Preparation Tips

Interview preparation tips for other job seekers - Prepere well in C language,Prepare CAN and LIN protocols used in automotive domain.

I applied via Walk-in and was interviewed before Jul 2020. There were 4 interview rounds.

Interview Questionnaire 

1 Question

  • Q1. Project based questions, Xtend and XML Language

Interview Preparation Tips

Interview preparation tips for other job seekers - We should be confident on what we know and what we have worked on.
Hold on technology.

I applied via Campus Placement and was interviewed in Feb 2021. There were 4 interview rounds.

Interview Questionnaire 

1 Question

  • Q1. Fluid dynamics formulas etc

Interview Preparation Tips

Interview preparation tips for other job seekers - I got placed on campus recruitment
1. Online Test (Aptitude/Mech basic mostly thermo and thermal)
2. Technical Interview (Projects/ Drawing FBD, Curves, Formulas, Logical Questions) My advice is try to answer even if you are wrong the interviewer will help you out and try not to loose confidence in between I too was not able to answer most of the technical questions.
3. HR Round (They took everyone who cleared Technical round, Just normal introduction and location preferences.)
Got the internship and RBEI has performance based conversion.

Interview Preparation Tips

Round: Resume Shortlist
Experience: Resume based initial shortlisting

Round: Test
Experience: Test included Quant, technical and logical aptitude sections (Online). Topics included were
Strength of Materials, Fluid Mechanics, and KDOMS

Round: Interview
Experience: Technical lasting around 45-50 min .Technical round will cover up all the profile related questions. Many questions on C and algorithms, microcontrollers and a puzzle.Be ready to be grilled on your internships and projects. Expect basic design concept based questions or core mechanical stuff. (Depends on your Department. So please revise the respective stuff!)

Round: Interview
Experience: HR round had normal stuff like Why Bosch? , Higher studies, achievements, Bosch's current work etc.
Tips: Please go through their website and have some knowledge about their ongoing work.Surf through all the courses and get your concepts right. Have a look at KDOMS.Stress/Strain equations, engineering drawing, IC engines, Thermodynamics, FEM.Knowledge of C helps too.
Prepare for questions on your resume and be honest. Participate in mock GD‟s and Alumni interviews.Go through GATE material while preparing for the technical part. Check the material on ftp servers.

College Name: IIT Madras

Interview Questionnaire 

5 Questions

  • Q1. Tell me about your self?
  • Ans. 

    I am an experienced Senior Engineer with a strong background in software development and project management.

    • Over 10 years of experience in software development

    • Proficient in multiple programming languages such as Java, C++, and Python

    • Extensive knowledge of software development methodologies and best practices

    • Proven track record of successfully leading and delivering complex projects

    • Strong problem-solving and analytical ...

  • Answered by AI
  • Q2. Which- which subjects u have studied? ( according to subject quoted many Q will be asked )
  • Q3. Q about projects?
  • Ans. 

    I have worked on various projects throughout my career, ranging from software development to infrastructure upgrades.

    • Developed a web application using Java and Spring framework

    • Led a team in implementing a cloud migration strategy for a large enterprise

    • Designed and implemented a scalable data processing system using Hadoop

    • Collaborated with cross-functional teams to deliver a mobile app for a healthcare startup

  • Answered by AI
  • Q4. Q about FEM?
  • Q5. Software skills?

Interview Preparation Tips

Round: Resume Shortlist
Experience: In this perpendicular company resume was short listed according to their requirements. They needed the candidate who is good on FEM. My whole project is based on FEM coding. GPA  doesn't matters. Many of my friends who have very good GPA (GPA more than me) were not short listed because their project were not matching with company's profile.
Tips: Should have good resume format. Highlight Software or some other special  skills. Write about the project in simple language so that every one can easily understand it. Also mention little about practical (application) aspect of your project.

Round: Technical Interview
Experience: . Listen complete question care fully and than answer. If you don't know the answer say u don't know instead of guessing the answer. Try not to mention those subjects (topics) in which you are not confident. If u are good in some field (software skill, coding, technical extra curricular activity, robotics, etc ) and interviewer do not ask any thing about that in that case you mention it with your own.
Tips: Try to talk more about your current project and recent activity.

Round: HR Interview
Experience: There are some specific Q that is asked in every HR interview. e.g:Tell about your self?



Family background



Why this company?Your future plans?Salary expectations?Why you why not others ??, tell me 3 reason.job location?Hobby ? Strength and weakness? etc.



And some more similar Q. (I am sure you all are aware this.)
Tips: Just answer confidently your first thought. Stay calm and maintain constant face expression through out interview.

Skill Tips: Just be  what  actually u are. They check stability of candidate on that particular Job profile, Salary and job location.
Skills: Coursework understanding, Skill related to their job profile.,
College Name: IIT DELHI

Bosch Packaging Technology Interview FAQs

How many rounds are there in Bosch Packaging Technology interview?
Bosch Packaging Technology interview process usually has 1 rounds. The most common rounds in the Bosch Packaging Technology interview process are Technical.
How to prepare for Bosch Packaging Technology interview?
Go through your CV in detail and study all the technologies mentioned in your CV. Prepare at least two technologies or languages in depth if you are appearing for a technical interview at Bosch Packaging Technology. The most common topics and skills that interviewers at Bosch Packaging Technology expect are Electricals, Technical Documentation, Packaging Machines, Mechatronics and Mechanical.
What are the top questions asked in Bosch Packaging Technology interview?

Some of the top questions asked at the Bosch Packaging Technology interview -

  1. Spring boot and angu...read more
  2. Java collecti...read more

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Bosch Packaging Technology Interview Process

based on 1 interview

Interview experience

4
  
Good
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Bosch Packaging Technology Reviews and Ratings

based on 11 reviews

2.3/5

Rating in categories

1.8

Skill development

1.6

Work-life balance

1.8

Salary

1.6

Job security

1.7

Company culture

1.5

Promotions

1.6

Work satisfaction

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