Senior Smt Engineer Interview Questions and Answers

To modify stencil, fixture, palets, support block and BGA rework stencil, one needs to follow specific steps.

• Stencil modification requires adjusting the aperture size and shape to improve paste deposition

• Fixture modification involves changing the clamping mechanism to ensure proper alignment

• Palet modification involves adjusting the tooling holes to fit the PCB

• Support block modification requires changing the height to accommodate components

• BGA rework stencil modification invol...read more

Multiple AOI defects can occur due to various reasons and can be resolved by identifying the root cause and taking corrective actions.

• AOI defects can include missing components, wrong polarity, tombstoning, bridging, etc.

• Root causes can be incorrect programming, machine calibration, component placement, solder paste printing, etc.

• Corrective actions can include reprogramming, recalibrating, adjusting placement parameters, improving solder paste printing, etc.

• Regular maintenanc...read more

Multiple SPI defects can occur due to various reasons, leading to poor quality and reliability of the product.

• SPI defects can be caused by issues with the solder paste, stencil design, or the reflow process.

• To resolve the issue, it is important to identify the root cause and take corrective actions.

• Improving the solder paste quality, optimizing the stencil design, and adjusting the reflow profile can help resolve the issue.

• Regular inspection and testing can also help prevent ...read more

SMT (Surface Mount Technology) is a process used in electronics manufacturing to mount electronic components onto the surface of a printed circuit board (PCB).

• SMT involves placing electronic components onto the PCB using solder paste and a pick-and-place machine.

• The solder paste is applied to the PCB using a stencil, and then the components are placed onto the paste.

• The PCB is then heated in a reflow oven, causing the solder paste to melt and create a permanent connection bet...read more

SMT process is a method of placing electronic components on a printed circuit board using surface mount technology.

• Solder paste is applied to the board

• Components are placed on the board using pick and place machines

• Board is heated to melt the solder paste and create a connection between components and board

• Reflow ovens are used to heat the board

• Inspection is done to ensure proper placement and soldering

• SMT process is faster and more efficient than through-hole technology