Embedded Engineer

Hydroscope is seeking a talented Electronics and Instrumentation Engineer to lead the design, development, and maintenance of electronic systems and instruments used in Hydroscope solutions. The position requires a strong background in analog and digital electronics, instrumentation, and control systems. The main responsibilities will be to ensure that Hydroscope hardware systems provide high quality and high reliability data based on proper design and testing of electronic circuits, development and implementation of control systems, troubleshooting and repairing electronic equipment, and ensuring compliance with industry standards and regulations. The position includes strong interactions with other engineering disciplines within Hydroscope, particularly sensor development, software engineering, data analytics.
Role & responsibilities As an IoT Electronics/Instrumentation Engineer at Hydroscope you will be responsible for:

• Propose, Review and optimize circuit designs according to project requirements.
• Propose, Review and optimize component choices, as well as optimize Bills of Materials (BOM).
• Collaborating with design and firmware engineers to establish criteria for hardware development projects.
• Proactively engaging with the mechanical team to deliver PCB designs aligned with enclosure specifications.
• Testing and debugging critical board circuits.
• Ensuring compliance with industry standards and norms
• Documenting all design, development, and testing activities..

Preferred candidate profile

• Bachelor's degree in Electronics and Communication Engineering or Electronics and Instrumentation Engineering.
• Minimum 2 years of professional experience in IOT hardware and communication system design.
• Knowledge in analog electronics.
• Knowledge of component selection and BOM creation.
• Capability to drive with contractors
• Familiarity with various Microprocessors and Microcontrollers, embedded systems in general.
• Understanding of PCB types, design, and fabrication processes at prototype and mass production levels.
• Skilful in designing for EMI/EMC considerations and compliances, manufacturability, and testability.
• Strong background in through-hole, SMT, and BGA technologies, including dual-sided assemblies and multilayer boards.
• Familiarity with serial communication architectures like I2C, SPI, USB, CAN, RS232, RS485, SDI-12; and communication protocols like TCP/UDP, Modbus, etc
• Self-starter with the ability to work independently.
• Excellent interpersonal and soft skills with an adaptable attitude in a dynamic work environment.