ESD Device Modelling Lead, TD ESD

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR53284 ESD Device Modelling Lead, TD ESD

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

The TD ESD/Latch-up Design and Characterization team at Micron Technology, Inc. is seeking an expert ESD Device Modelling Lead, TD ESD with the emphasis of conducting ESD/LUP DOE enablement, data collection and translate it to the SPICE model, collaborate with the memory design engineers on running ESD Simulations. This position is a lead position as the selected member represents TD ESD Modelling team to the various customers/circuit designers across different verticals in Micron.

• Conduct ESD/LUP DOE experiments to investigate the device physics and mechanisms to be modelled in the device.
• Fully evaluate the high current and voltage properties of the ESD IO, input or power clamps circuits.
• Assess the fundamental ESD properties of each type of ESD circuit elements, from active diffusions to BEOL metal layers, by wafer level transmission line pulse (TLP and vf-TLP) measurements.
• Develop the modelling strategy for ESD Devices and BEOL metal layers.
• Develop ESD device models based of the measured ESD data.
• Manage and coordinate ESD device model validation tests that meets Micron s minimum qualification requirements.
• Collaborate with the SPICE modelling team for model delivery.
• Deliver ESD SPICE Models to the customers/Micron Memory design engineers.
• Continually improve model quality through innovation.

Successful candidates for this position will have:

• Hands-on experience in ESD device model development and delivery.
• Good understanding of standard BSIM Models, tools and CMC device modeling standards.
• A strong knowledge of advanced semiconductor device physics, including deep submicron CMOS devices.
• A good understanding of state-of-the-art CMOS process technology and electrical circuit analysis.
• Experience in Cadence design tools for design, layout, and verification tools.
• Hands-on experience in ESD characterization analysis using wafer level transmission line pulse (TLP) test equipment would be a plus.
• Experience waveform generators, oscilloscopes, source/measure units, Agilent and/or Keithley parametric analyzers/testers, and impedance analyzers.
• Strong data analysis skills are required to extract the high current ESD properties.
• Strong oral and written communication skills are required to provide ESD technical leadership with diverse worldwide teams in Design, Product Engineering, R&D characterization, and Quality Assurance teams.

Minimum Qualifications:

• A BS Electrical Engineering, Microelectronics, or related discipline with 10 years of experience, OR
• A MS in Electrical Engineering, Microelectronics, or related discipline with 8 years of experience, OR
• A Ph.D. in Electrical Engineering, Microelectronics, or related discipline with 5 years of experience.

Preferred Qualifications:

An MS/PhD in Electrical Engineering, Microelectronics, or related discipline, with 10+ years of experience