Sr. Package Reliability Engineer

As a GQ (Global Quality) Sr. Package Reliability Engineer at Micron Technology Inc., we are primarily responsible for package quality and reliability for Micron s product lines working end to end for NVM qualification, provide inputs and approve phase gates, HVM monitoring and dispositions.

Responsibilities and Tasks:

Lead Regulation for New Product Qualifications

• Coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced

• Provide comprehensive qualification plans for new developments

• Provide recommendations on product release based on package reliability test results

Design and Implement Reliability Test Plans

• Devise reliability test plans to assess risk associated with excursions, conversions, and reliability and qualification issues

• Provide advice for accurate screen method for quality concerned lots

• Sustain appropriate monitoring methodology for quality

Regulate Root Cause and Corrective Action Plans

• Lead 8D report processes

• Coordinate root cause and corrective action efforts within the GQ department for package related qualification failures and RMAs (failures from customers)

• Prepare reports for discussion with partners.

• Engage in phase gate review starting from design to production release and ensure CTQ compliance and inline validation.

Act as a liaison for both Internal and External Customers

• Evaluate whether internal and external customer requests are reasonable and acceptable for Micron quality policy

• Provide technical support for package-related quality and reliability issues

• Supply technical expertise for customer requests

• HVM reliability monitoring would be a key responsibility for this role which require day to day planning, execution, risk assessment and disposition.

Requirements:

• Education back ground of a min Bachelor s Degree in Electronics, Material Science, Mechanical or equivalent experience

• Detailed knowledge of semiconductor component package assembly processes and challenges

• Knowledge of surface mount processes and challenges

• Understanding of mechanical and material interaction effects on reliability of IC components and/or Printed Circuit Assemblies (PCB) assemblies

• Understanding of the effects thermo mechanical, thermal, mechanical and hygroscopic swelling stresses on package reliability

• Understanding of industry standard reliability test methods of package level and board level, acceleration models used for life predictions, and sampling statistics preferred

• Must be self-motivated, able to work independently, and detail oriented

• Strong analytical problem solving skills, excellent multi-tasking skills and the ability to interact easily with other groups

• Understanding of statistics and quality management (SPC, FMEA, 8D CAR, etc)

• Good written and interpersonal skills, digital literacy are vital. proven understanding of the software systems employed in backend manufacturing and analytics is a plus like MAM, MES, JMP, Tableau etc