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Microsys Software

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5.0

based on 1 Review

340 Microsys Software Jobs

Package Development Engineer

Micron Software

5.0

based on 1 Review

1-4 years

Hyderabad / Secunderabad

1 vacancy

Package Development Engineer

Microsys Software

posted 1mon ago

Job Role Insights

Key skills for the job

Artificial Intelligence Recruitment Semiconductor Thermal Plant Operational Excellence SIP

+ 3 more

Job Description

This role is for a Package design Engineer within Package Development Engineering (PDE) team. You will be involved with the design of package design/substrate layout for cutting edge mobile, consumer, and high-performance applications. You will be tasked with the layout and design of effective package layouts that meet outstanding technical standards. You will own and drive advanced package design and layout in a timely manner - and have ultimate responsibility for package/SIP layout, optimization, layout verification and taping out . The team develops package and substate designs and helps in cycle time reduction and quality/yield improvements.

Roles & responsibilities can include but are not limited to:

Responsible the package design integration activities by working with cross-functional team and partners for package technology development, including material development, process development, DOEs, and related activities.
Work with a cross-functional team across several geographies to create package design databases such as package stack-up, wire-bond fanout, route-study, substrate layout, wire bond/Die placement diagrams, and other design documentation.
Work with Substrate and PCB (Printed Circuit Board) suppliers, OSATs (Outsourced Semiconductor Assembly and Test), and other ecosystem partners to meet their requirements in Design for manufacturing (DFM)/ Design for Assembly (DFA)
Design complex package layout keeping in mind signal integrity, power integrity, thermal and mechanical requirements.
Contributing to cross group communication to work towards standardization and group success.
Strong oral and written communication skills .