Electrical Failure Analysis Engineer

Responsibilities and Tasks

• Identify and communicate yield issues on production and test wafers

• Analyze probe, parametric and fab data to identify yield issues

• Perform electrical and visual characterization of failing die to establish fail mechanism.

• Deprocessing of failing die to identify defects

• Publish and present reports on analysis of process experiments detailing yield impact.

• Apply knowledge of Si fabrication steps to identify and trouble shoot yield issues.

• Identification of yield excursions and correlation back to root cause.

• Detects complicated process interactions and relates it to failures. Provides, feedback to increase yield goals

• Identifies unexpected fail mechanisms and helps resolve underlying issues.

• Identify interactions between process modules and/or equipment to detect fail mechanisms.

• Using Device Physics knowledge relate parametric shifts to yield issues

• Demonstrate expertise in product architecture, cell operation, probe flows, and related topics to increase yield.

• Propose methods to determine solutions for new fail mechanism

• Recognize opportunities for yield improvements and provide feedback to RD management.

• Standardize methods and procedures to promote consistent, comparable, and repeatable processes to improve yield.

• Use innovative methods to tackle highly complex problems

• Define and implement plans to solve outstanding yield issues that will drive quality and optimize yield.

Safety Related

• Identify and promptly report hazards

• Follow safety procedures and area work rules including proper PPE, lockout and chemical safety.

• Operate and maintain equipment and tools within manufacturer s and company guideline s

• Use proper lifting techniques and work in an ergonomically correct manner

Requirements .

• Bachelors degree in electrical / electronic engineering or a related field

• Experience working with tools such as bench testers , Oscilloscopes, Curve Tracer etc

• 2 + Year of industry experience or demonstrable experience in debugging electrica l failures of semiconductor memory

• Knowledge of assembly process like wire bond, die attach, DBG, Molding, Saw singulation, laser mark, laser cut, etc. is a plus