Senior IC Package Designer

What we're looking for

We are seeking an IC Package Designer for a contract role with 3-5 years of experience in semiconductor package design, particularly with multi-die implementations. The successful candidate will play a crucial role in the design, validation, and optimization of advanced packaging solutions for our integrated circuits.

Responsibilities

• Design and develop multi-die IC packages using industry-leading and open source tools.
• Collaborate with cross-functional teams to integrate multiple designs into cohesive systems.
• Conduct simulations for signal integrity (SI) and power integrity (PI) to ensure optimal performance.
• Create detailed documentation for package design specifications and manufacturing processes.
• Familiarity with high-speed interfaces and chip-to-chip communication protocols.

Qualifications

• Bachelors or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
• 3-5 years of relevant experience in IC package design, with a focus on multi-die solutions and high speed interfaces.
• Proficiency in design tools such as Cadence Allegro, Mentor Graphics Xpedition, or similar Open Source software.
• Strong analytical skills and ability to troubleshoot complex design issues.