Announcement For the post of Lead Engineer or Technical Lead

• The primary role of Lead Engineer/Technical Lead will be to design cooling methods for electronic components and overall system.
• Evaluate and propose efficient cooling method.
• Design of Heat sink, selection of materials for interface for electrical insulation and better thermal conductivity.
• Fan selection for cooling. Design of system with forced air-cooling method.
• Design of system with low acoustic noise.
• Work with cross functional team to develop product conceptualization for the requirement.
• Create and modify mechanical designs and drawings using solid works for system and sub-systems.
• Analyze design for structural integrity, thermal performance, material performance, manufacturability , and serviceability.
• Develop product that is compliance with global safety and regulation requirements.
• Able to handle issues independently and lead a team of junior engineers.
• Candidate should have a strong innovative mind set and be able to work as a team.

Essential Qualifications:

• Doctorate (fresher) or masters degree with 5+ years of industrial experience in R&D with specialization in Mechanical/Mechatronics Engineering or related degree with knowledge of electronic component/systems thermal design.
• Hands on experience in Ansys ICEPACK or similar software used for electronic systems thermal design, DFMEA, tolerance analysis, RCA methods, design for high volume manufacturing.

Preferred Experience:

• The candidate should have sound design knowledge of heat sink and forced air cooling method.
• Experience analysis like worst case, tolerance, creepage and clearance.
• Working knowledge of Ansys ICEPACK or similar thermal analysis software
• Understanding interface with solid works and Ansys software.
• Advanced heat sink design and selection of interface materials
• Knowledge of conducting environmental testing,
• Demonstrated experience in designing products with IEC/UL requirements.
• Experience in system architecture design & cross-functional integration.
• Should have experience in solving Thermal issues in commercial product.
• Proven track record to demonstrate the design robustness through structured root cause analysis,tolerance analysis, worst-case circuit analysis.
• Demonstrated experience to complete product development life cycle (concept to EOL)
• Experience in working with global customers and manufacturing companies will be a plus.
• Work experience in global startups/MNCs.
• Ability to handle issues independently and lead a team of junior engineers.
• Product development experience in Agile will be a plus.

Perks and benefits

Consolidated pay ₹1,00,000 (minimum) per month all inclusive; actual designation and salary

will be commensurate with qualifications,experience, and expertise.