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Texas Instruments Field Application Engineer Interview Questions and Answers

Updated 9 Feb 2022

Texas Instruments Field Application Engineer Interview Experiences

1 interview found

I applied via Campus Placement and was interviewed in Aug 2021. There were 3 interview rounds.

Round 1 - Aptitude Test 

2 parts: Analog (Mostly OpAmps) & Aptitude

Round 2 - Technical 

(1 Question)

  • Q1. Questions based upon OpAmps And Network Theory.
Round 3 - HR 

(2 Questions)

  • Q1. Tell me about yourself.
  • Ans. 

    I am a highly skilled Field Application Engineer with expertise in troubleshooting and providing technical support for complex systems.

    • Experienced in analyzing customer requirements and designing customized solutions

    • Proficient in conducting product demonstrations and training sessions

    • Strong problem-solving skills and ability to work under pressure

    • Excellent communication and interpersonal skills

    • Familiarity with various ...

  • Answered by AI
  • Q2. What is your family background?
  • Ans. 

    My family background is diverse and multicultural, with members from different professions and backgrounds.

    • My father is a doctor and my mother is a teacher.

    • I have two siblings, one is an engineer and the other is a lawyer.

    • We have relatives living in different countries, which has exposed me to various cultures and traditions.

    • Growing up, family gatherings were always filled with lively discussions and debates on various...

  • Answered by AI

Interview Preparation Tips

Topics to prepare for Texas Instruments Field Application Engineer interview:
  • OpAmps
  • Network Theory
Interview preparation tips for other job seekers - Aptitude test is the difficult part, once you clear it, in interviews all you just need is strong basics of Analog and Network Theory.

Interview questions from similar companies

Interview experience
1
Bad
Difficulty level
Hard
Process Duration
More than 8 weeks
Result
Selected Selected

I applied via Indeed and was interviewed before Jan 2024. There were 4 interview rounds.

Round 1 - Technical 

(2 Questions)

  • Q1. Questions based on analog circuit design, verilog modules, register transistor logics, CMOS etc
  • Q2. Common questions related to analog circuits, specifically focusing on MOSFETs.
Round 2 - Technical 

(1 Question)

  • Q1. Project related questions mostly based on practical implementations and issues debugged.
Round 3 - Technical 

(1 Question)

  • Q1. Project related questions and managerial questions.
Round 4 - HR 

(1 Question)

  • Q1. Typical HR questions

Interview Preparation Tips

Interview preparation tips for other job seekers - Prepare for best and expect the worst in terms of interview experience. HR management is worst and they'll keep finding replacements of yours even after selecting. So you should also have plan B incase your candidature gets rejected. I declined the offer and joined another company.
Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Technical 

(1 Question)

  • Q1. Sta basics , digital electronics
Round 3 - Technical 

(1 Question)

  • Q1. Cmos, basics , working
Round 4 - HR 

(1 Question)

  • Q1. Introduction and future prospects

Interview Preparation Tips

Interview preparation tips for other job seekers - Nice company with good work culture . Located in Greater noida.
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Referral and was interviewed before Mar 2023. There were 3 interview rounds.

Round 1 - One-on-one 

(1 Question)

  • Q1. Explain functional and code coverage.
  • Ans. 

    Functional coverage ensures all functions are tested, while code coverage ensures all lines of code are executed.

    • Functional coverage focuses on testing the functionality of the design.

    • Code coverage ensures that all lines of code are executed during testing.

    • Functional coverage helps in identifying missing or incomplete functionality.

    • Code coverage helps in identifying untested code paths.

    • Example: Functional coverage may ...

  • Answered by AI
Round 2 - Technical 

(1 Question)

  • Q1. Questions on AHB protocol.
Round 3 - Technical 

(1 Question)

  • Q1. Digital design based questions.

Skills evaluated in this interview

I applied via Recruitment Consulltant and was interviewed before Jun 2021. There were 2 interview rounds.

Round 1 - Technical 

(1 Question)

  • Q1. Question related to FPGA. It's flow, timing violation ans it's solution. Verilog questions blocking and non blocking assignment etc , basic question from vivado
Round 2 - Technical 

(1 Question)

  • Q1. Mostly same question related to FPGA

Interview Preparation Tips

Interview preparation tips for other job seekers - Prepare question around FPGA , timing , constraints, verilog basics for a FPGA engineer profile
Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Technical 

(1 Question)

  • Q1. Sequence detector circuit
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Campus Placement and was interviewed before Jul 2023. There were 3 interview rounds.

Round 1 - Aptitude Test 

(2 Questions)

  • Q1. Sta question, to find set up and hold time
  • Q2. C basic questions
Round 2 - Technical 

(2 Questions)

  • Q1. Nonblock vs blocking difference with an example
  • Ans. 

    Nonblocking operations allow the program to continue executing other tasks while waiting for a response, while blocking operations halt the program until a response is received.

    • Nonblocking operations allow for asynchronous communication, while blocking operations are synchronous.

    • Nonblocking operations are typically used in event-driven programming, while blocking operations are common in traditional procedural programm...

  • Answered by AI
  • Q2. DFF Vs latch difference
  • Ans. 

    DFF stores data based on clock signal, while latch stores data based on enable signal.

    • DFF stands for Data Flip-Flop, while latch is a level-sensitive storage element.

    • DFF stores data on the rising or falling edge of the clock signal, while latch stores data when the enable signal is high.

    • DFF has two stable states (0 or 1), while latch has only one stable state.

    • Example: D flip-flop, T flip-flop are examples of DFF, while

  • Answered by AI
Round 3 - HR 

(2 Questions)

  • Q1. Where you see yourself in 5 years
  • Ans. 

    In 5 years, I see myself leading a team of engineers in developing innovative products and solutions.

    • Leading a team of engineers in a design department

    • Developing innovative products and solutions

    • Continuing to learn and grow in my role

    • Possibly pursuing further education or certifications

    • Contributing to the success and growth of the company

  • Answered by AI
  • Q2. What are you priorities
  • Ans. 

    My priorities are to deliver high-quality designs, meet project deadlines, and continuously improve my skills.

    • Delivering high-quality designs that meet client requirements

    • Meeting project deadlines to ensure timely completion

    • Continuously improving my skills through training and learning new technologies

  • Answered by AI

Interview Preparation Tips

Topics to prepare for STMicroelectronics Design Engineer interview:
  • C
  • System Verilog
  • Verilog
  • Digital Electronics
  • STA
  • CMOS
Interview preparation tips for other job seekers - Basics, c, Verilog, system Verilog should be good

Skills evaluated in this interview

Interview experience
4
Good
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Technical 

(1 Question)

  • Q1. STA , setup and hold?

Interview Preparation Tips

Round: Test
Experience: Questions were from digital Electronics which included realization of counters using JK FF,Sequence detector,Boolean expression reduction,One shot and drawing waveforms of some digital circuits.Questions were also their from pipelinig,finding out MIPS,power consumption of two processors,Small signal analysis of MOSFETs,Buffer using CMOS ,finding out the type of filter given block diagram(control theory).Questions were easy and required step by step realization.
Tips: Prepare digital Electronics very well as it has 50% weightage in paper. Pipelinig is important. Some basics concepts of CMOS is very necessary.
Duration: 1hr 15 min minute
Total Questions: 12

Round: Technical Interview
Experience: First they asked to introduce yourself.
Then they asked about projects & Internship.
STA,EEPROM,EPROM,DRAM,SRAM,CACHE Memory,Pipelining,DMA was asked in depth.
Difference between clock skew and Jitter.
Asked whether I know any Hardware Languages.
XOR gate using 2:1 MUX.
Gave a waveform,had to realize using DFF and considering the delay.
Tips: Study STA very well.
Questions will be asked in depth from any topic.

Round: HR Interview
Experience: Family Background
Why NXP
Hobbies


Skill Tips: Study Digital Electronics very well
Skills: Analog Electronics, Microprocessor, Vlsi Basics, Digital Circuits
College Name: BIT Mesra

Interview Preparation Tips

Round: Test
Experience: Questions were from Digital Electronics,Microprocessors and some from CMOS.
50% Digital Electronics.
1 X Output waveform drawing from circuit of FFs & gates
1 X Realize inverter from given two blocks
1 X CMOS implementation of gates
1 X Realize digital circuit for given waveform
1 X MIPS & Pipelining
1 X Processors power Dissipation calculation
1 X Small Signal analysis of CMOS
1 X Compare two given buffers circuits(CMOS)
1 X Transfer function calculation(Control Theory)
1 X Counter using JK FF
1 X Sequence Detector

Tips: Study digital electronics very well.

Duration: 1 hr 45 min minute
Total Questions: 12

Round: Technical Interview
Experience: Indroduction
Projects & Internship
Discussions in DEPTH on:
Pipelining
STA
MIPS
Memory(flash memory,DRAM,SRAM)
CACHE Memory
DMA
Digital circuit realization for given waveform
XOR Gate using 2:1 MUX
Tips: Prepare Digital electronics and Microprocessors very well.Sta is very important.Panel will go deep into the topics to check ur technical knowledge.
TIPS: Be confident and your opinion should be strong.Stand by what you say.Do not get confused.And when panel asks to solve any digital circuits, speak loud what is in your mind and what approach you are using.Be honest.

Round: HR Interview
Experience: Family Background
Why Freescale


Skills: Static Timing Analysis (STA), Memory, CMOS Circuits, Microprocessor, Digital Circuits
College Name: BIT Mesra
Motivation: I had interest in core electronics

Texas Instruments Interview FAQs

How many rounds are there in Texas Instruments Field Application Engineer interview?
Texas Instruments interview process usually has 3 rounds. The most common rounds in the Texas Instruments interview process are Aptitude Test, Technical and HR.
How to prepare for Texas Instruments Field Application Engineer interview?
Go through your CV in detail and study all the technologies mentioned in your CV. Prepare at least two technologies or languages in depth if you are appearing for a technical interview at Texas Instruments. The most common topics and skills that interviewers at Texas Instruments expect are Analog, Analytical, Project Delivery, Sales and Semiconductor.

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