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Technosoft Engineering Projects Limited Senior Firmware Engineer Interview Questions and Answers

Updated 18 Dec 2023

Technosoft Engineering Projects Limited Senior Firmware Engineer Interview Experiences

1 interview found

Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Approached by Company and was interviewed in Nov 2023. There were 2 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - One-on-one 

(1 Question)

  • Q1. Microcontroller, RTOS, Embedded C and C++,protocols

Interview Preparation Tips

Interview preparation tips for other job seekers - Prepare well in following topics

Interview questions from similar companies

Interview experience
4
Good
Difficulty level
Moderate
Process Duration
2-4 weeks
Result
Selected Selected

I applied via LinkedIn and was interviewed in Nov 2023. There were 2 interview rounds.

Round 1 - Coding Test 

General c coding. Questions were given and I need to do live coding.

Round 2 - Technical 

(2 Questions)

  • Q1. Technically question from the R&D manager and PO
  • Q2. Design concepts.

Interview Preparation Tips

Interview preparation tips for other job seekers - Basic electrical and electronics should be clear.
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
2-4 weeks
Result
Selected Selected

I applied via LinkedIn and was interviewed in Nov 2023. There were 2 interview rounds.

Round 1 - Coding Test 

General c coding. Questions were given and I need to do live coding.

Round 2 - Technical 

(2 Questions)

  • Q1. Technically question from the R&D manager and PO
  • Q2. Design concepts.

Interview Preparation Tips

Interview preparation tips for other job seekers - Basic electrical and electronics should be clear.

Technosoft Engineering Projects Limited Interview FAQs

How many rounds are there in Technosoft Engineering Projects Limited Senior Firmware Engineer interview?
Technosoft Engineering Projects Limited interview process usually has 2 rounds. The most common rounds in the Technosoft Engineering Projects Limited interview process are Resume Shortlist and One-on-one Round.

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Technosoft Engineering Projects Limited Senior Firmware Engineer Interview Process

based on 1 interview

Interview experience

5
  
Excellent
View more

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14% less than the average Senior Firmware Engineer Salary in India
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Technosoft Engineering Projects Limited Senior Firmware Engineer Reviews and Ratings

based on 2 reviews

3.5/5

Rating in categories

1.5

Skill development

1.9

Work-life balance

3.5

Salary

2.4

Job security

1.9

Company culture

2.5

Promotions

1.5

Work satisfaction

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