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Open Silicon Research Intern Interview Questions and Answers

Updated 27 Mar 2021

Open Silicon Research Intern Interview Experiences

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Intern Interview Questions & Answers

user image Anonymous

posted on 27 Mar 2021

I applied via Campus Placement and was interviewed before Mar 2020. There were 3 interview rounds.

Interview Questionnaire 

2 Questions

  • Q1. Mostly about my past project and about my past company.
  • Q2. Must have good knowledge about fpga and scala /

Interview Preparation Tips

Interview preparation tips for other job seekers - if you have good knowledge in fpga and scala then dream place to work .

Interview questions from similar companies

Intern Interview Questions & Answers

Intel user image Anonymous

posted on 5 May 2018

I applied via Campus Placement

Interview Questionnaire 

2 Questions

  • Q1. Extensive discussion on minor projects. I had one in wireless communication and was asked technical questions based on my description of the project work.
  • Q2. Questions on digital logic design. I was asked to write an FSM for a problem statement. This was followed by some basic questions on data structures and algorithms, like tree traversal etc. (Don't worry if...

Interview Preparation Tips

Round: Resume Shortlist
Experience: Shortlisting of candidates based on UG CGPA from CS, EC, EE and IT branches.

General Tips: Be thorough with your basics. A good command over digital logic and computer architecture is a plus.
Skills: Communication, Problem Solving, Analytical Skills
Duration: <1 week

Intern Interview Questions & Answers

Intel user image Anonymous

posted on 18 Jul 2022

I applied via Campus Placement and was interviewed before Jul 2021. There were 3 interview rounds.

Round 1 - Technical 

(1 Question)

  • Q1. SDLC, digital circuit, rtl
Round 2 - Technical 

(1 Question)

  • Q1. Rtl coding verilog system verilog
Round 3 - HR 

(1 Question)

  • Q1. Introduction, hr policy company profile

Interview Preparation Tips

Interview preparation tips for other job seekers - Be strong in technical and know coding any programming language and scripting language. Know the things and concepts put in CV
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
-
Result
Selected Selected

I applied via Campus Placement and was interviewed before Jul 2022. There were 3 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Aptitude Test 

Written test consist of digital electronics, coding section, verilog and aptitude questions

Round 3 - Technical 

(2 Questions)

  • Q1. In Technical interview, They asked what ever skills you have mentioned in your resume..not more than that.
  • Q2. Flip flop conversion, c coding logic test, RTL etc
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
6-8 weeks
Result
Selected Selected

I applied via Company Website and was interviewed in Jun 2022. There were 3 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Coding Test 

Basic Verilog coding and digital design questions

Round 3 - HR 

(2 Questions)

  • Q1. Details on education, grades, career interests...etc If we offer you a permanent role after successful internship are you willing to join
  • Q2. What are your grades
  • Ans. 

    I have consistently maintained high grades throughout my academic career.

    • I have consistently achieved top grades in all my courses.

    • I have a GPA of 3.8 on a scale of 4.0.

    • I have received several academic awards and honors for my outstanding performance.

    • I have excelled in subjects like mathematics, computer science, and physics.

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Please refresh your digital design concepts. Flip flops, FSMs...etc
Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - One-on-one 

(2 Questions)

  • Q1. What do you know about Bill of Materials
  • Ans. 

    Bill of Materials (BOM) is a comprehensive list of raw materials, components, and assemblies required to build a product.

    • BOM is used in manufacturing to ensure all necessary materials are available for production.

    • It includes details such as part numbers, quantities, and descriptions of each item.

    • BOM can be hierarchical, with sub-assemblies listed under main assemblies.

    • It helps in cost estimation, inventory management, ...

  • Answered by AI
  • Q2. Name a time you had conflict with a co worker and how did you resolve it
Interview experience
5
Excellent
Difficulty level
Hard
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Recruitment Consulltant and was interviewed in May 2023. There were 4 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Coding Test 

C++,DSA,OOPs Concept

Round 3 - Technical 

(4 Questions)

  • Q1. Virtual function inheritance Tree Graph STL
  • Q2. Virtual Function
  • Q3. Unordered Map Map Multimap
  • Ans. 

    Unordered Map is a container that stores key-value pairs with unique keys. Map is a container that stores key-value pairs with unique keys. Multimap is a container that stores key-value pairs with duplicate keys.

    • Unordered Map does not maintain any particular order of elements.

    • Map maintains the order of elements based on the key's comparison function.

    • Multimap allows duplicate keys and stores them in sorted order.

  • Answered by AI
  • Q4. Polymorphism runtime
Round 4 - One-on-one 

(1 Question)

  • Q1. Smart Pointer Function pointer Operator overloading

Skills evaluated in this interview

I applied via Campus Placement and was interviewed in Dec 2021. There were 3 interview rounds.

Interview Questionnaire 

1 Question

  • Q1. About projects

Interview Preparation Tips

Interview preparation tips for other job seekers - Digital electronics, verilog code
Interview experience
1
Bad
Difficulty level
Hard
Process Duration
2-4 weeks
Result
No response

I appeared for an interview before Feb 2023.

Round 1 - Coding Test 

3 coding questions out of which 2 are easy and 1 is medium

Round 2 - Technical 

(1 Question)

  • Q1. 2 Interviewers kept on asking to write codes for each and every question they ask. I was given a tree problem and coded everything from scratch and executed written test cases and again I was asked to solv...
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Recruitment Consulltant and was interviewed in May 2024. There was 1 interview round.

Round 1 - Technical 

(1 Question)

  • Q1. Questions based on digital design verilog, sv, SVA, Linting, etc were asked

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