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Koch Business Solutions Product Engineer Interview Questions and Answers for Freshers
Koch Business Solutions Product Engineer Interview Experiences for Freshers
1 interview found
Anonymous
I applied via Naukri.com and was interviewed in Mar 2024. There was 1 interview round.
(2 Questions)
- Q1. What is the difference between ductile and malleable material
- Ans.
Ductile materials can be drawn into wires, while malleable materials can be hammered or rolled into thin sheets.
Ductile materials can be drawn into wires without breaking.
Malleable materials can be hammered or rolled into thin sheets without breaking.
Ductile materials include metals like copper and aluminum.
Malleable materials include metals like gold and lead.
- Q2. State laws of thermodynamics, basic g d and t questions
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I applied via Campus Placement and was interviewed in Oct 2020. There was 1 interview round.
Interview Questionnaire
4 Questions
- Q1. Tell me about yourself
- Q2. Why IT
- Q3. About my project
- Q4. Few mechanical questions
Interview Preparation Tips
Interview Questionnaire
1 Question
- Q1. Drupal data migration
Interview Questionnaire
1 Question
- Q1. Basic coding, sorting, C
I applied via Company Website and was interviewed before Nov 2020. There were 3 interview rounds.
Interview Questionnaire
3 Questions
- Q1. Typing test speed of 30 words per minute and HR interview round interview
- Q2. HR interview self introduction and reasons for gap in employment
- Q3. HR round interview final
Interview Preparation Tips
I applied via Referral and was interviewed in Oct 2020. There were 3 interview rounds.
Interview Questionnaire
1 Question
- Q1. Its from Java, Springboot, Microservices.. and touchbase of UI technologies such as Angular.
Interview Preparation Tips
Thats how you can think logically.
then only you will be able to crack.
I applied via Referral and was interviewed before Sep 2020. There were 5 interview rounds.
Interview Questionnaire
3 Questions
- Q1. Technical Questions
- Q2. Why should we hire you?
- Q3. How do you rate yourself?
Interview Preparation Tips
I applied via Campus Placement and was interviewed before Jan 2021. There were 3 interview rounds.
Interview Questionnaire
1 Question
- Q1. Self Intro about us, and some basic tech questions like coding for for loop while loop etc
Interview Preparation Tips
I applied via Campus Placement and was interviewed before Jan 2021. There were 4 interview rounds.
Interview Questionnaire
2 Questions
- Q1. Oops concepts
- Q2. Overloading and overriding
Interview Preparation Tips
Ps- difficulty level will be on your luck
I applied via Campus Placement and was interviewed before Jul 2021. There were 3 interview rounds.
Questions on basic Maths and English
(1 Question)
- Q1. Questions on OOPs, OS and Networking
(1 Question)
- Q1. Questions like Why u want to work in an IT domain even though i am from mechanical, What are ur goals/ambition.
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Koch Business Solutions Product Engineer Interview Process for Freshers
based on 1 interview
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