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I applied via Company Website and was interviewed in Oct 2020. There were 2 interview rounds.
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Electroplating is a process of depositing a layer of metal onto a surface using an electric current.
Electroplating involves immersing the object to be plated (called the substrate) into a solution containing metal ions.
A direct current is then passed through the solution, causing the metal ions to be attracted to the substrate and form a metal coating.
Common applications of electroplating include improving the appearan...
I applied via Company Website and was interviewed in Jul 2023. There were 3 interview rounds.
Computer technical science mcq question
I applied via Campus Placement and was interviewed before May 2021. There were 3 interview rounds.
Maths, English Grammer, G.k
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