Cipsa Tec

CIPSA TEC India Private Limited (formerly CIPSA-RIC India Private Limited) acquired business in 2005 from erstwhile Rao Insulating Company Limited (RIC) who started PCB manufacturing in 1987 with technical collaboration from UNICAP, Taiwan. It is a multinational organization by partnering with CIPSA, Spain and TECNOMEC, Italy both of whom are leaders in their own country in the arena of PCB manufacturing. These two partners with their rich experience of 3 decades in PCB manufacturing, they have remained pillars of strength in our growth in Technology, Process Control and Process Improvement and Market expanse in Europe. CIPSA TEC’s current manufacturing facility is fairly new plant and was set up by SIEMENS in Germany. In 2007, the same was relocated to India. It is a state of the art facility compiled with latest technology machineries manufactured by the leaders in the industry to meet the latest market demands. 30,000sqmtrs is the installed capacity of this plant, which we shall attain in phases by year 2012. Current capacity of 13,000 sqmtrs per month is getting augmented to 18,000sqmtrs by June 2013. Our growth rate has been enormous; we have grown 3 times in the last 5 years. Our current operation is in the building of 15,000sqmtrs within the sprawling area of 60,000sqmtrs gives us further potential to expand. We produce 2 to 8 layers of quantity 1 to 1million pieces. We also offer QUICK TURN services to the R&D sector (irrespective of volumes). We mainly cater to Automotive and Energy sectors apart from Telecommunication, Peripherals and Industrial automation. Over 40% of our produce is exported to European countries. Vision of Management and commitment of over 400 dedicated and experienced work force ensures that quality products and services are delivered to customer at most competitive prices. Our product confirms to UL standards and also certified by Government of India for needs of Telecommunication and Defence sectors. Our QMS standard confirms to ISO9001:2008 and TS-16949:2009. ISO-14001 certification shall be in place during second half of 2011.