Cadence Design Systems
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6% above
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About Cadence Design Systems
Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware, and IP that turn design concepts into reality. For six years in a row, Fortune Magazine has named Cadence one of the 100 Best Companies to Work For. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications including consumer, hyperscale computing, 5G communications, automotive, aerospace, industrial and health. We pride ourselves on creating and sustaining a company culture, that drives innovation and business success. Cadence is recognized as a Great Place to Work around the world, including as one of the Fortune “100 Best Companies to Work For” over the last six years.
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Change Company | Change Company | Change Company | ||
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Overall Rating | 4.1/5 based on 271 reviews | 3.9/5 based on 346 reviews | 3.9/5 based on 114 reviews | 4.0/5 based on 55 reviews |
Highly Rated for | Company culture Work-life balance Job security | Work-life balance Job security Company culture | Work-life balance Job security Company culture | Job security Work-life balance Skill development |
Critically Rated for | No critically rated category | No critically rated category | No critically rated category | No critically rated category |
Primary Work Policy | Hybrid 70% employees reported | Hybrid 68% employees reported | Hybrid 58% employees reported | - |
Rating by Women Employees | 4.1 Good rated by 62 women | 3.9 Good rated by 79 women | 3.7 Good rated by 21 women | 3.7 Good rated by 10 women |
Rating by Men Employees | 4.1 Good rated by 190 men | 3.9 Good rated by 244 men | 4.0 Good rated by 86 men | 4.0 Good rated by 30 men |
Job security | 4.0 Good | 3.9 Good | 3.9 Good | 4.5 Good |
Cadence Design Systems Salaries
Lead Software Engineer
Software Engineer2
Principal Software Engineer
Design Engineer
Lead Design Engineer
Software Engineer
Product Validation Engineer 2
Software Engineer II
Design Engineer II
Lead Application Engineer
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Cadence Design Systems News
Investors Head into Holiday-Shortened Week
- Investors are heading into a holiday-shortened week with notable economic events and earnings reports scheduled.
- On Tuesday, U.S. economic lookahead includes the Home builder confidence index for February.
- Featured earnings on Tuesday include companies like Arista Networks Inc., Medtronic plc, and Cadence Design Systems Inc.
- In Canada, economic events such as Housing Starts, International Transactions in Securities, and CREAstats MLS Sales are of interest.
- Featured earnings in Canada on Tuesday include companies like Appili Therapeutics Inc., Gibson Energy Inc., SSR Mining Inc., and Sandstorm Gold Ltd.
- Wednesday brings a focus on U.S. economic indicators like Housing Starts, Building Permits, and the release of the Fed's January FOMC meeting minutes.
- Notable earnings to watch on Wednesday include HSBC Holdings plc, Analog Devices, Inc., and Carvana Co.
- In Canada on Wednesday, the Consumer Price Index for January is a key economic event.
- Featured earnings in Canada on Wednesday include companies like Alamos Gold Inc., B2Gold Corp., Bausch Health Companies Inc., and more.
- Thursday features U.S. Initial Jobless Claims, leading economic indicators, and earnings reports from companies like Walmart Inc., Alibaba Group Holding Limited, and Booking Holdings Inc.
![Investors Head into Holiday-Shortened Week](http://www.baystreet.ca/images/articlegroups/original/31/theweekahead3.jpg)
Automotive Security Shifts To The System Level
- As the amount of semiconductor and software content continues to increase, so does the number of over-the-air updates and connections to edge-based servers and services, adding a variety of new vectors for attacks.
- Properly securing vehicles requires engineers to first identify all the possible connection points.
- In the strictest sense, there’s only one direct attack vector on a car, according to David Glasco, vice president for compute solutions group at Cadence — the WiFi through which all software updates are uploaded.
- The migration toward holistic security now includes roots of trust installed in ICs located throughout the car’s systems.
- “Security is just like safety,” he said. “Security is the ultimate. It is the top priority.
- The challenge for automakers is understanding how these systems of systems will behave both individually and together, and that may require security training as a pre-requisite for any facet of automotive design.
- SDVs are booming, but designing hardware that can run software updates a decade in the future is a huge challenge.
- The core of all security comes down to proper, strong cryptography.
- “Having multiple environments is very similar to having different privilege levels within the CPU structure, which allows you to assign a very low privilege, for example, to a third-party app,” he said.
- The international standard has been proven effective in automotive functional safety and has begun to spread to other markets.
![Automotive Security Shifts To The System Level](https://semiengineering.com/wp-content/uploads/Car-AdobeStock_237685068-01-29-25-scaled.jpeg?fit=2560%2C1440&ssl=1)
Automotive Outlook 2025: Ecosystem Pivots Around SDV
- The automotive industry is shifting towards the software-defined vehicle architectures (SDV) that will change how automakers design, source, and use automotive chips.
- SDV provides various benefits to automakers because it can reduce manufacturing costs, upgrade the operational platform quickly, support scalability and flexibility, and deliver advanced user experience.
- SDV requires software-first development and a shift from the mechanical and hardware-centric point of view to software-centralized infrastructure that can build and integrate the hardware accordingly.
- This shift involves creating a zonal architecture with powerful central CPUs to consolidate electronic control units (ECUs) into fewer, more powerful platforms that centralize processing resources in vehicles.
- The zonal architecture enables the integration of advanced technologies such as AI and autonomous driving systems, and it simplifies the vehicle design process while reducing complexity, weight, and cost.
- Chip vendors are building multi-die licensable devices featuring multiple chips in a single package, allowing the creation of advanced products using advanced packages at 3nm and a range of chiplets from different vendors.
- SDV enhances AI use in the vehicle, delivering an advanced user experience that learns from driver behaviors and enhances automated driving systems with end-to-end self-supervised learning and advanced AI in the vehicle.
- Software-defined development speeds up the introduction of new technologies that OEMs and Tier Ones are embracing. However, OEMs and Tier Ones must adapt to software-first development with a focus on security since the distribution of software centrally intensifies security issues.
- SDV makes it possible to develop software independently within the cloud on servers and substantially reduces the development time and cost with a level of flexibility and scalability that traditional hardware development cannot match.
- Virtual platforms and virtual prototypes are accelerating the software and silicon development cycles, simultaneously designing the hardware and software, testing them for security, scalability, flocking everything together into a scalable E/E architecture for the whole car.
![Automotive Outlook 2025: Ecosystem Pivots Around SDV](https://semiengineering.com/wp-content/uploads/AdobeStock_262996090-feb-13-2023.jpeg?fit=2560%2C1593&ssl=1)
Med Tech Morphs Into Consumer Wearables
- Doctors have been using advanced technology for years, but the growing trend is for consumers to use devices at home and have direct access to their data.
- Watches and rings that were once primarily used for counting steps or registering sleep patterns can now read blood pressure, heart rate, blood oxygen, body temperature, and other early signs of illness.
- DSPs coupled with MEMS sensors are commonly used in wearable devices, along with other types of sensors, and/or electrodes, which are then connected to a data analytics platform via Bluetooth or Wi-Fi.
- Ansys also is exploring wearable optical sensors and helping designers address such challenges as compact system integration, precise optical path management, and real-world lighting conditions to ensure the wearables deliver reliable, actionable insights.
- The smart watch market growth rate was expected to decline as the technology matured, while the hearables market was predicted to grow. Demand for smart rings and glasses is also expected to increase.
- Medical devices face much more stringent testing than consumer devices, but regulators are starting to approve more technology.
- Home-use medical devices can come in many forms, depending on what data is being captured.
- Artificial intelligence, machine learning, and other tools have been used in the medical space for some time and applications are surfacing every day for better ways of filtering data to provide better insight than a human is capable of, such as screening for breast cancer.
- Devices and patches can gather data, but they also can create haptic sensations beyond vibration.
- For example, Infineon partnered with Theranica on a migraine patch.
![Med Tech Morphs Into Consumer Wearables](https://semiengineering.com/wp-content/uploads/MIT-News-MouthIO-.png?fit=900%2C600&ssl=1)
Universities Augment Curricula To Boost Engineering Graduates Employability
- Universities are offering semiconductor courses in various degree programs such as engineering, math, physics, and business degrees.
- Purdue University President, Mung Chiang established Purdue’s Semiconductor Degrees Program to meet the industry demand for a semiconductor workforce.
- RIT offers a five-year BS degree program that includes a year of co-ops at one or more companies in microelectronics along with courses in imaging processes and materials.
- Georgia Tech’s ECE has created courses through its Curriculum Partnership Initiative with companies such as Apple for VLSI Design through Theory to Tapeout and TI to support analog and mixed-signal design curriculum.
- Community colleges are taking care of technician-level training while universities are offering pathways from associate degree programs to pursue a Bachelor of Science degree.
- Cornell and Micron are developing orbital welding techniques classes for both technicians and engineers.
- To help students get hands-on experience, some universities provide summer training, awareness, and readiness for semiconductors (STARS) internships.
- The education sector is also developing certificates courses, and colleges aimed at increasing diversity.
- Universities are aiming to introduce students to the semiconductor field early in their studies.
- Academic institutions are keeping pace with the requirements of the industry to help them acquire specialized knowledge in microelectronics to match the demand in the industry.
![Universities Augment Curricula To Boost Engineering Graduates Employability](https://semiengineering.com/wp-content/uploads/schools1.png?fit=820%2C542&ssl=1)
The Role of Chiplets in Redefining Semiconductor Design
- Chiplets offer a modular approach to chip manufacturing, addressing challenges in performance, scaling, and time-to-market.
- The Universal Chiplet Interconnect Express (UCIe) standard provides a common interface for chiplets from different vendors.
- UCIe and Arm's Chiplet System Architecture (CSA) enable seamless communication and compatibility among chiplets.
- Collaborations between companies like Cadence and Arm drive innovation in chiplet design and accelerate time-to-market.
![The Role of Chiplets in Redefining Semiconductor Design](https://3d-legacy-media.nyc3.digitaloceanspaces.com/wp-content/uploads/20241204132355/CadenceUCIeHero.jpeg)
Redefining Hearing Aids With DSPs
- Advancements in hearing aid technology promise improved acoustic experiences, employing modern techniques like binaural processing and neural networks.
- Despite advancements, challenges remain in hearing aid design and adoption, including the need for smaller, more discreet devices and low-power architectures.
- Cadence Tensilica HiFi and Fusion F1 DSP family offer energy-efficient solutions for audio and voice applications in hearing aid development.
- Cadence, along with partners, is working on innovations to improve signal processing and noise reduction in hearing aids.
![Redefining Hearing Aids With DSPs](https://semiengineering.com/wp-content/uploads/Cadence_Redefining-Hearing-Aids-With-DSPs-fig1.webp?fit=434%2C347&ssl=1)
Blog Review: Oct. 30
- Hardware-assisted verification techniques like emulation and prototyping are essential for improving design behavior.
- Ultra high-density interconnect (UHDI) is changing PCB design and production, enabling high-density circuitry.
- Automating PCB documentation generation reduces time and effort invested in developing and maintaining multiple documents.
- Root causes of errors in electrostatic discharge (ESD) verification are explored, highlighting factors that can yield incorrect resistances.
![Blog Review: Oct. 30](https://semiengineering.com/wp-content/uploads/iStock-1361389765-data-center-11-29-2023.jpeg?fit=1365%2C768&ssl=1)
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