Assembly Operations Process Engineer Front End (SAW)

Assembly Operations - Process Engineer ,Front End Saw [ Wafer / Package ]

Position Code ( 126)

Job location : Sanand, Ahmedabad [ Gujrat ]

Education & Experience : 02 years to 05 years

• BE ( Mechanical / Electrical & Electronics / Electronics & Computers ).

Company Overview : CG Semi Private Limited, a subsidiary of CG Power and Industrial Solutions Limited, is a pioneering joint venture with Renesas Electronics Corporation and Stars Microelectronics (Thailand) Public Co. Ltd. Our state-of-the-art OSAT facility in Sanand is a significant milestone in Indias high-tech manufacturing landscape, dedicated to producing a diverse range of semiconductor packages for industries including Automotive, Consumer Electronics, Industrial Manufacturing, and 5G technology.

Process Engineer - Wafer saw and Package saw

Position Code ( 126)

Wafer saw / package saw process engineer, is responsible for designing, developing, deploying and optimizing processes to achieve quality cost and delivery goals for CG Semiconductor and its customers products.

Qualification : BE ( Mechanical / Electrical & Electronics / Electronics & Computers )

Experience : 02 - 04 years of experience in die attach, flip chip attach process development preferred.

Detailed Description

Performs tasks such as, but not limited to, the following:

• Strong knowledge on wafer saw and package saw process and basic understanding of the machine functions.
• Able to design and develop process parameters to meet the yield, productivity and cost as required by the department or company.
• Able to work with training department to develop technical training manuals.
• Deep understanding on metallurgy and material properties and fatigue knowledge is preferred.
• Develop detailed and meaningful OCAP for effective trouble shooting guide for line people.
• Supervise Technicians and support whenever needed.
• Able to develop and update work Instruction (WI), Control plan, PFMEA and FA documents support.
• Continuous process improvement activities utilizing wide variety of analytical techniques (such as SPC, DOE, Gauge R&R), lean manufacturing and six sigma concepts.
• Leader in Product quality improvement, DFM, DFA, Engineering Evaluation.
• Analyse losses (planned & unplanned downtime) and develop action to reduce losses to improve OEE.
• Able to deal with customer request and good communication with customers and vendors.
• Evaluation of new material or component part use in production.
• Evaluation and develop Process and new Technology.

Knowledge/Skills/Competencies

Typical Experience

• Min 2 years experience in back grind process development is preferred.
• Work Experience and understand in semiconductor assembly line is required.
• Strong Knowledge on sensors, bearings, drive mechanism, diamond studded saw blade knowledge is preferred.
• Hands-on experience in machine set-up and operation for wafer and package saw machine (Disco) is an advantage
• Proficient in root cause and failure mode Analysis
• Familiar with cleanroom and ESD protocols
• Knowledge of Auto CAD 2D, 3D or Solid work program is preferred.
• Excellent interpersonal skills and demonstrated communication skills.
• Self-motivated, proactive and innovative problem-solving capabilities, Management skill and Presentation skill.
• Able to motivate and inspire people to achieve daily targets.

Why Join Us?

At CG Semi, youll be part of a ground breaking initiative shaping the future of semiconductor manufacturing in India. Join our team and contribute to a culture of innovation and excellence.

Regards I Talent Acquisition Team

CG Semi Private Limited

subsidiary of [ CG Power & Industrial Solutions Limited ]

Tube Investments of India Limited [ Murugappa Group ]

Linkedin : https://www.linkedin.com/company/cg-semi-private-limited

Regards I Talent Acquisition Team