Process Engineers Die Attach

Job Description : Process Engineers Die Attach

Position Code : P_Code [ 125 ]

Job location : Sanand, Ahmedabad [ Gujrat ]

Education & Experience : 02 years to 05 years

• BE ( Mechanical / Electrical & Electronics / Electronics & Computers ).

Company Overview : CG Semi Private Limited, a subsidiary of CG Power and Industrial Solutions Limited, is a pioneering joint venture with Renesas Electronics Corporation and Stars Microelectronics (Thailand) Public Co. Ltd. Our state-of-the-art OSAT facility in Sanand is a significant milestone in Indias high-tech manufacturing landscape, dedicated to producing a diverse range of semiconductor packages for industries including Automotive, Consumer Electronics, Industrial Manufacturing, and 5G technology.

Role : Process Engineer - Die Attach ( P_Code: 125 )

Role Overview : Die attach process engineer, is responsible for designing, developing, deploying and optimizing processes for die attach process to achieve quality cost and delivery goals for CG Semiconductor and its customers products.

Qualification : BE ( Mechanical / Electrical & Electronics / Electronics & Computers )

Experience : 02 - 04 years of experience in die attach, flip chip attach process development preferred.

Detailed Description : Performs tasks such as, but not limited to, the following:

• Strong knowledge on die attach process and basic understanding of the machine functions.
• Able to design and develop process parameters to meet the yield, productivity and cost as required by the department or company.
• Able to work with training department to develop technical training manuals.
• Develop detailed and meaningful OCAP for effective trouble shooting guide for line people.
• Supervise Technicians and support whenever needed.
• Able to develop and update work Instruction (WI), Control plan, PFMEA and FA documents support.
• Continuous process improvement activities utilizing wide variety of analytical techniques (such as SPC, DOE, Gauge R&R), lean manufacturing and six sigma concepts.
• Leader in Product quality improvement, DFM, DFA, Engineering Evaluation.
• Analyse losses ( planned & unplanned downtime) and develop action to reduce losses to improve OEE.
• Able to deal with customer request and good communication with customers and vendors.
• Evaluation of new material or component part use in production.
• Evaluation and develop Process and new Technology.

Knowledge/Skills/Competencies

Key Experience

• Min 2 years experience in die attach, flip chip attach process development preferred.
• Work Experience and understand in semiconductor assembly line is required.
• Strong Knowledge on sensors, bearings, drive mechanism is preferred.
• Hands-on experience in machine set-up and operation for die bonders is an advantage
• Proficient in root cause and failure mode Analysis
• Familiar with cleanroom and ESD protocols
• Knowledge of Auto CAD 2D, 3D or Solid work program is preferred.
• Excellent interpersonal skills and demonstrated communication skills.
• Self-motivated, proactive and innovative problem-solving capabilities, Management skill and Presentation skill.
• Able to motivate and inspire people to achieve daily targets.

Why Join Us?

At CG Semi, youll be part of a ground breaking initiative shaping the future of semiconductor manufacturing in India. Join our team and contribute to a culture of innovation and excellence.

Regards I Talent Acquisition Team

CG Semi Private Limited

subsidiary of [ CG Power & Industrial Solutions Limited ]

Tube Investments of India Limited [ Murugappa Group ]

Linkedin : https://www.linkedin.com/company/cg-semi-private-limited

Regards I Talent Acquisition Team