40 Raspberry PI Jobs

Job Area:Engineering Group, Engineering Group > Hardware Engineering



General Summary:
As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.



Minimum Qualifications:

Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.

OR
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.

OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.

Job Function

Qualcomm is looking for candidates to support its customers in designing solutions using Qualcomm hardware and software. Individual will contribute to the dynamic Customer engineering team for end product designs. Individual will be responsible for supporting Qualcomm's growing portfolio of platforms/applications and the job involves working closely with internal partners in definition of product as appropriate. Work closely with Qualcomm customers to design and enable HW PCBs across different applications.

About The Role :

As a member of Qualcomm Customer engineering team, the individual will be responsible for successful integration of Qualcomm solution into customer end products in Mobile, PC, IoT, Automotive and consumer electronics markets.

Experience in designing industry Standard form factor modules like SMARC, COM Express, COM HPC, Single Sided LGA, OSM etc

Proficient in schematic capture tools like OrCAD and Siemens Mentor Graphics Designer.

Proficient in PCB layout tools like Cadence Allegro and Siemens Mentor Graphics Expedition.

Proficient in Power Distribution Network (PDN) methodologies and schemes.

Proficient in routing topologies for PC-DDR, DDR, and termination schemes.

Proficient in routing schemes of high-speed interfaces like USB 3, PCIe 3+, Ethernet (1 Gbps or higher) and other SERDES interfaces

Knowledge of high-speed simulation tools like Ansys Q3D, Cadence Sigrity, and Sentinel is necessary ·

Candidates should have excellent communication skills (oral and written), to handle external customers across the geographies

Hands on knowledge of running PDN (power distribution network) simulations of a PCB is desired

Experience in analog, power, digital, and RF PCB layout aspects.

Hands-on experience with multilayer PCBs (at least 12 layers, at least 10 cm x 10 cm, with a processor or FPGA having > 500 pins and pitch smaller than 0.5 mm) and upto 2.00mm thickness.

Knowledge of PCB layout tools like Altium Designer and Mentor PADS is a plus.

Knowledge of thermal impacts and mechanical constraints on a PCB.

Experience in documenting PCB guidelines, checklists, and rules. Candidate should have 5-8 years of relevant experience. Past expertise in interacting with multiple teams in HW, domain skills in Digital/High Speed/SoC is desirable.

Candidates should be proficient in reviewing schematics & PCB layout of customer designs, in accordance with Qualcomm and general electrical guidelines and checks

Hands-on with electrical test & measurement equipments like oscilloscopes, power supplies, multimeters, data loggers are a plus

Exposure to general purpose prototyping platforms like Arduino, Raspberry Pi are a plus

Preferred Qualifications

Sound understanding of HW and PCB design.

Strong understanding of signal integrity and electromagnetic compatibility (EMC) principles.

Experience with Design for Manufacturability (DFM) and Design for Testability (DFT) practices.

Familiarity with IPC standards for PCB design and manufacturing.

Ability to perform design reviews and provide constructive feedback.

Excellent problem-solving skills and attention to detail.

Effective communication skills for collaborating with cross-functional teams.

Ability to manage multiple projects and meet deadlines.

Keywords ·

PCB Board Design, Modules, PCB CAD, SMPS, LDO, Antenna, SMARC, COM Express, COM HPC, Single Sided LGA, OSM, HPCMini

Educational Requirements Required:

Bachelor's, Electronics and/or Electrical Engineering



Applicants:Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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