ICB4

• Block Level and Full chip level Static(IR)/Dynamic(IVD) sign-off
  Signal/Power EM sign-off at Block level and Full chip
• Custom power grid implementation for block/hardmacs
  System level Analysis (PDN) with board, package, interposer and die
• Work with SoC and packaging team in bump assignment, pkg routing optimization
  Dynamic analysis with vectorless/vectors/mixed mode analysis
• PG Grid resistance checks
• Knowledge of physical implementation is a plus

Skill Set :

• Hands-ons experience in RedHawk/RHSC/Voltus/PDN analysis/3DIC
• Good understanding on Power Integrity Signoff Checks
• Knowledge of Perl, TCL, Python
• Familiarity with Innovus/ICC
• Ability to communicate effectively with global cross functional teams