Sr. Engineer-PCB Design

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Job responsibilities:

• Technical Expertise : Should possess very strong PCB technical knowledge on high speed layouts with HDI technology and have very good experience with DDR4/DDR5, PCIe4/5/6, UFS, USB,JTAG,SPI and I2C interfaces placement and routing consideration.
• Design and Development: Lead the design and development of DIMM modules layout, SSDs drive PCB layouts, Evaluation and Test PCB layouts.
• Quality Assurance: Ensure all designs comply with industry standards(IPC) and regulatory requirements(UL,IEC).
• Problem Solving: Troubleshoot and resolve issues related to PCB design and manufacturing.
• Documentation: Maintain detailed documentation of PCB designs, modifications, and testing procedures.
• Collaboration: Work closely with other engineering teams, including hardware, simulation(SI/PI), and mechanical engineers, to integrate PCBs into larger systems.
• Continuous improvement: Participate in internal technical, DFM/DFA, Continuous Improvement, Industry standard and other meetings as necessary

Qualifications:

• Education: Candidate must have Bachelor s or Master s degree in Electronics Engineering, Electrical Engineering or related field.

• Experience: Candidate should have minimum of 12 years of experience in PCB design & development and able to deliver the complex PCB layout as an individual contributor.
• Skills:
  • Proficiency in PCB design software ( Cadence Allegro), strong understanding of electronic circuits, Knowledge of HDI Stack up and different via technologies, and excellent problem-solving skills.
  • Strong knowledge on DFM/DFA constraints are essential.
  • Also hands on experience in valor and Cam350 preferred.
  • A thorough understanding of Signal Integrity (SI), Power Integrity (PI), and Electromagnetic Compatibility (EMC) requirements is crucial.

• Communication: Strong verbal and written communication skills to effectively collaborate with team members and stakeholders.
• Attention to Detail: High level of attention to detail to ensure precision in designs and compliance with standards.