CAE Engineer

Your Opportunity:

As FEA expert Lead see it's a unique and critical role for our Product development, with Roles and Responsibility listed below, and growth would see in T shaped approach with both breadth (Capacity) and Depth (Capability).

Essential Responsibilities:

• Highly proactive with strong analytical, problem-solving skills, and advanced-level knowledge of machine design.
• Perform variety of engineering analyses using first order calculations and FEA tools, in areas of static structural deformations, dynamic structural analysis, thermal and flow. Optimizes designs based on analysis, often in collaboration with design engineers.
• Perform thermal design and analysis of Mechanical, Optics and electronics assemblies components to estimate thermal performance, including thermal distribution, hotspots, and critical components.
• Experience in the simulation driven structural design of large mechanical assemblies.
• Proficient in analytical calculations of bolted/welded joints, static linear, nonlinear, dynamic, buckling, and fatigue analysis. Good understanding of HCF/LCF and fracture mechanics.
• Knowledge of material selection.
• Demonstrate strong system-level thinking and the ability to provide design suggestions based on simulation results.
• Produce high-quality documentation for assigned work.
• Ability to analyze problems from a physical perspective and provide quick, system-level solutions.
• Experience interacting with multiple teams to ensure design meets all requirements.
• Ability to work independently with minimal supervision in a fast-paced, rapidly changing work environment.

• M.Tech in Mech/Aero/Applied Mechanics from a reputed institution such as IIT/IISc/NIT
• Experience Level 8 - 14 years of experience in Heat Transfer ,CFD and thermal management of Mechanical, Optics and electronics assemblies
• Strong understanding of heat and mass transfer fundamentals and CFD.
• Extensive experience with Ansys Fluent and workbench for detailed system-level analysis (fluid dynamics and heat transfer fundamentals).
• Hands-on experience with 3D design software Autodesk Inventor (preferable for transferring 3D models to the Ansys environment).
• Knowledge of Commercial tools such as Icepak, Flotherm, Fluent, Ansys Workbench, ICEM CFD, Hypermesh
• Strong understanding of physics related to thermal performance of components in Semiconductor Equipment's
• Experience in Electronics Cooling , die and PCB level modeling is a plus
• Experience in Thermal-Electric simulationg using ANSYS Maxwell is a plus
• Good communication skills both oral/writing