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I applied via Approached by Company and was interviewed in Dec 2023. There was 1 interview round.
I applied via Company Website and was interviewed in May 2024. There was 1 interview round.
Aptitude test is very difficult It takes more time for thinking
I applied via Company Website and was interviewed in Jan 2024. There were 3 interview rounds.
Soldering on Printed Circuit Board
Soldering is a process of joining electronic components to a PCB using solder
It requires heating the solder and applying it to the joint
Soldering ensures electrical and mechanical connections on the PCB
Proper soldering techniques are crucial for reliable circuit operation
Common soldering tools include soldering iron, solder wire, and flux
Techniques like through-hole soldering and surfa...
About my Testing ,my skills
About any topic on gd
I applied via Campus Placement and was interviewed in Aug 2023. There were 2 interview rounds.
Yes, I am willing to work rotational shifts as required for the job.
I am flexible and adaptable to different work schedules.
I understand the importance of meeting project deadlines and will adjust my schedule accordingly.
I have previous experience working in rotational shifts at my previous job.
I am committed to my work and will ensure that my performance is not affected by the shift changes.
I applied via Campus Placement and was interviewed in Sep 2022. There were 2 interview rounds.
I applied via Company Website and was interviewed before Feb 2022. There was 1 interview round.
My interest area is in developing hardware solutions for IoT and automation systems.
Designing and implementing embedded systems
Developing firmware for microcontrollers
Creating PCB layouts and schematics
Working with sensors and actuators
Integrating hardware with software systems
Experience with Arduino, Raspberry Pi, and other development boards
I applied via Walk-in and was interviewed before Jan 2021. There were 3 interview rounds.
based on 1 review
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