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I was interviewed before Oct 2016.
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I applied via Naukri.com and was interviewed in Nov 2024. There were 2 interview rounds.
I applied via Approached by Company and was interviewed in Dec 2024. There were 2 interview rounds.
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I applied via Recruitment Consulltant and was interviewed before Dec 2023. There were 2 interview rounds.
PFD stands for Process Flow Diagram in Surface Mount Technology (SMT).
PFD is a visual representation of the sequence of steps in a manufacturing process for SMT.
It shows the flow of materials, components, and information through the process.
PFD helps in understanding the overall process and identifying potential areas for improvement.
Example: PFD of SMT may include steps like solder paste application, component placeme
Defects in soldering in SMT can lead to issues in electronic components.
Common defects include insufficient solder, solder bridges, tombstoning, and cold solder joints.
Causes of defects can include improper temperature settings, poor solder paste quality, and incorrect component placement.
Quality control measures such as visual inspection, X-ray inspection, and automated optical inspection can help identify and prevent...
posted on 28 Dec 2024
I applied via Approached by Company and was interviewed before Dec 2023. There were 3 interview rounds.
I applied via Naukri.com and was interviewed in Nov 2024. There were 2 interview rounds.
I applied via Approached by Company and was interviewed in Dec 2024. There were 2 interview rounds.
What is your work experience
What is your personal details
I applied via Recruitment Consulltant and was interviewed before Dec 2023. There were 2 interview rounds.
PFD stands for Process Flow Diagram in Surface Mount Technology (SMT).
PFD is a visual representation of the sequence of steps in a manufacturing process for SMT.
It shows the flow of materials, components, and information through the process.
PFD helps in understanding the overall process and identifying potential areas for improvement.
Example: PFD of SMT may include steps like solder paste application, component placeme
Defects in soldering in SMT can lead to issues in electronic components.
Common defects include insufficient solder, solder bridges, tombstoning, and cold solder joints.
Causes of defects can include improper temperature settings, poor solder paste quality, and incorrect component placement.
Quality control measures such as visual inspection, X-ray inspection, and automated optical inspection can help identify and prevent...
based on 12 reviews
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Process Engineer
62
salaries
| ₹2.4 L/yr - ₹5.1 L/yr |
Junior Engineer
60
salaries
| ₹1.8 L/yr - ₹4 L/yr |
Engineer
58
salaries
| ₹2.2 L/yr - ₹5.5 L/yr |
Production Engineer
53
salaries
| ₹2.2 L/yr - ₹4.6 L/yr |
Quality Engineer
46
salaries
| ₹2.2 L/yr - ₹4.5 L/yr |
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