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Lohum Cleantech Embedded Engineer Interview Questions and Answers

Updated 3 Dec 2022

Lohum Cleantech Embedded Engineer Interview Experiences

1 interview found

Interview experience
3
Average
Difficulty level
-
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via Campus Placement and was interviewed in Nov 2022. There were 4 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Assignment 

Assignment related to battery design for a given conditions

Round 3 - Group Discussion 

What government policies can be implemented for circular economy?

Round 4 - One-on-one 

(2 Questions)

  • Q1. Introduction followed with internship and how you got in to that particular stream.
  • Q2. Resume drilling and concepts related to your branch.

Interview Preparation Tips

Interview preparation tips for other job seekers - Must have great knowledge over your resume and topics related to your resume and algorithms implemented in your resume and why only that algorithms but not others.

Interview questions from similar companies

Interview Questionnaire 

1 Question

  • Q1. State machines

I applied via Referral and was interviewed before Sep 2020. There was 1 interview round.

Interview Questionnaire 

2 Questions

  • Q1. Basic c programming
  • Q2. Previous experience questions

Interview Preparation Tips

Interview preparation tips for other job seekers - Be honest. And prepare well in data structures

I applied via Referral and was interviewed before Jan 2021. There were 3 interview rounds.

Interview Questionnaire 

1 Question

  • Q1. Your Introduction

Interview Preparation Tips

Interview preparation tips for other job seekers - Be confident as you are this is the main thing that you should and tell all the things which you experienced in your last organization

I applied via Campus Placement and was interviewed in Dec 2016. There were 5 interview rounds.

Interview Questionnaire 

2 Questions

  • Q1. Communication Concepts
  • Q2. Embedded Concepts

Interview Preparation Tips

Round: Resume Shortlist
Experience: Shortlisted based on CGPA and Profile
Tips: CGPA above 7.5 and Communication/CS based coursework/ability

Round: Test
Experience: C Coding Questions which checked basic knowledge of C
Tips: Brush up your C skills. Questions are easy but may require knowledge of stuff like what is big endian and little endian etc.
Duration: 1 hour 30 minutes
Total Questions: 12

Round: Technical Interview
Experience: My Communication relation concepts were tested. My Major Project was asked in detail.
Tips: If Comm background, prepare ITC, MultiCarrier/Wireless at a good level. If not they will ask C.

Round: Technical Interview
Experience: I was asked basic level embedded concepts.
Tips: Prepare on the following and similar stuff : How to implement a pseudo dynamic memory allocation using flash memory- which data structure to use. How does Inter Process Communication work. How does a multicore processor synchronizes its cores. If Comm background, give the TX and RX chain design (Wireless System Design)

Skills: Communication Systems, Embedded Systems, C Programming
College Name: IIT Madras

Software Engineer Interview Questions & Answers

MaxLinear user image Gayathri S ee15m052

posted on 4 Dec 2016

I applied via Campus Placement and was interviewed before Dec 2015. There were 2 interview rounds.

Interview Preparation Tips

Round: Test
Experience: It was a written test with some numerical aptitude questions and coding questions. The test was fairly easy
Duration: 1 hour

College Name: IIT Madras

I applied via Campus Placement and was interviewed in Dec 2016. There were 3 interview rounds.

Interview Preparation Tips

Round: Test
Experience: It was a written test with some numerical aptitude questions and coding questions. The test was fairly easy
Tips: Learn about pointers and using function pointers

Round: Technical Interview
Experience: First, I was asked to brief about the projects I have done so far. Then there were some questions about C programming like pointers, const pointers, storage classes, volatile keyword etc. It was followed by some basic questions about computer architecture, microcontroller, FPGA, RTOS

Round: Technical Interview
Experience: In this round I was asked to write algorithm for some simple problems like checking if a given integer (not string) is palindrome or not, checking if a number is a multiple of 3 (using bitwise operations) etc

College Name: IIT Madras
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Referral and was interviewed before Jan 2023. There were 2 interview rounds.

Round 1 - HR 

(1 Question)

  • Q1. Introduce your self
Round 2 - Group Discussion 

Ap per your job profile

Interview Preparation Tips

Interview preparation tips for other job seekers - Be confident, know about yourself and company,
Demand as you want (i.e. salary, post) initially

I applied via LinkedIn and was interviewed in Apr 2022. There were 3 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Don’t add your photo or details such as gender, age, and address in your resume. These details do not add any value.
View all tips
Round 2 - Aptitude Test 

OS Networks C Programming Aptitude Mcqs

Round 3 - Coding Test 

Two Coding questions and were of medium to hard level.

Interview Preparation Tips

Interview preparation tips for other job seekers - be Cool and Calm and answer as required. Dont Panic.
Round 1 - Technical 

(1 Question)

  • Q1. In which face we develop PPAP documents
  • Ans. 

    PPAP documents are developed in the Production Part Approval Process (PPAP) face.

    • PPAP documents are developed during the production part approval process.

    • This is typically the fourth phase of the APQP (Advanced Product Quality Planning) process.

    • PPAP documents include items such as control plans, FMEAs, and measurement system analysis.

    • The purpose of PPAP is to ensure that all parts meet customer requirements and specifi...

  • Answered by AI
Round 2 - Technical 

(1 Question)

  • Q1. What is the shrinkage value of pa66
  • Ans. 

    The shrinkage value of pa66 varies depending on the specific grade and processing conditions.

    • Shrinkage is the reduction in size of a molded part as it cools and solidifies.

    • The shrinkage value of pa66 can range from 1.5% to 3.5%.

    • Factors that affect shrinkage include mold design, processing parameters, and part geometry.

    • It is important to account for shrinkage when designing molds and parts to ensure proper fit and funct

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Be confident while you giving answers and you feel the answer is wrong then directly say it to interviewer that "No idea "

Lohum Cleantech Interview FAQs

How many rounds are there in Lohum Cleantech Embedded Engineer interview?
Lohum Cleantech interview process usually has 4 rounds. The most common rounds in the Lohum Cleantech interview process are Resume Shortlist, Assignment and Group Discussion.

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Lohum Cleantech Embedded Engineer Interview Process

based on 1 interview

Interview experience

3
  
Average
View more

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