Filter interviews by
I applied via campus placement at Siddaganga Institute of Technology (SIT) and was interviewed in Aug 2021. There were 3 interview rounds.
5S is a workplace organization method that improves efficiency and safety. Basic manufacturing process involves designing, producing, and delivering products.
5S stands for Sort, Set in Order, Shine, Standardize, and Sustain.
Sort involves removing unnecessary items from the workplace.
Set in Order involves organizing the remaining items in a logical and efficient manner.
Shine involves cleaning and maintaining the workpla...
Top trending discussions
posted on 24 Apr 2023
I applied via Referral and was interviewed before Apr 2022. There was 1 interview round.
My favourite subject is Mathematics.
I enjoy solving complex problems and equations.
I find it satisfying to arrive at a correct solution.
Mathematics is a fundamental subject that is applicable in various fields such as engineering and finance.
I applied via LinkedIn and was interviewed in May 2024. There was 1 interview round.
Yes, I am able to operate machines independently with experience in troubleshooting and maintenance.
I have experience operating various machines independently
I am skilled in troubleshooting and maintenance of machines
I can follow technical manuals and instructions accurately
I am familiar with safety protocols and procedures for operating machines
posted on 18 Apr 2024
I applied via Walk-in and was interviewed in Mar 2024. There were 2 interview rounds.
Basic welding question
I applied via Recruitment Consulltant and was interviewed in Aug 2023. There was 1 interview round.
The engine is a machine that converts fuel into mechanical energy to power vehicles, machines, or equipment.
Converts fuel into mechanical energy
Powers vehicles, machines, or equipment
Can be internal combustion engine or electric motor
A wire bonding machine is a tool used in semiconductor manufacturing to connect wires to semiconductor devices.
Wire bonding machines use heat, pressure, and ultrasonic energy to bond wires to semiconductor devices.
There are different types of wire bonding machines, such as ball bonding and wedge bonding machines.
Wire bonding is a crucial step in the production of integrated circuits and other semiconductor devices.
posted on 26 Jun 2024
Mathamatics resoning
posted on 20 Apr 2024
I applied via LinkedIn and was interviewed before Oct 2023. There was 1 interview round.
Successfully implemented a new production process resulting in a 20% increase in efficiency.
Identified areas for improvement in the production process
Developed and implemented a new process
Trained staff on the new process
Monitored and analyzed results to ensure success
One of my weaknesses is that I can be overly critical of my own work, which can sometimes lead to perfectionism.
I tend to be a perfectionist and can spend too much time on minor details.
I sometimes struggle with delegating tasks because I want to ensure they are done correctly.
I can be overly self-critical, which can impact my confidence at times.
posted on 27 Sep 2024
I applied via campus placement at Sandur Polytechnic, Bellary and was interviewed before Sep 2023. There were 2 interview rounds.
Route cause analysis
Engineer
215
salaries
| ₹2 L/yr - ₹7.2 L/yr |
Specialist
201
salaries
| ₹3 L/yr - ₹9.2 L/yr |
Group Leader
181
salaries
| ₹4.4 L/yr - ₹11.7 L/yr |
Production Engineer
157
salaries
| ₹1.5 L/yr - ₹7.2 L/yr |
Quality Engineer
151
salaries
| ₹1.3 L/yr - ₹8 L/yr |
Bharat Forge
TVS Sundram Fasteners
Rane (Madras)
Ramkrishna Forgings