Dexcel Electronics Designs Fpga Engineer Interview Questions and Answers

Q1. Introduce your self
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Ap per your job profile

Q1. In which face we develop PPAP documents
Ans. 
PPAP documents are developed in the Production Part Approval Process (PPAP) face.
• PPAP documents are developed during the production part approval process.

• This is typically the fourth phase of the APQP (Advanced Product Quality Planning) process.

• PPAP documents include items such as control plans, FMEAs, and measurement system analysis.

• The purpose of PPAP is to ensure that all parts meet customer requirements and specifi...read more
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Q1. What is the shrinkage value of pa66
Ans. 
The shrinkage value of pa66 varies depending on the specific grade and processing conditions.
• Shrinkage is the reduction in size of a molded part as it cools and solidifies.

• The shrinkage value of pa66 can range from 1.5% to 3.5%.

• Factors that affect shrinkage include mold design, processing parameters, and part geometry.

• It is important to account for shrinkage when designing molds and parts to ensure proper fit and funct
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Q1. VLSI & Embedded
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Q1. Ram and rom basic inputs
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They need fewer people in less salary, so don't waste your time.

Electronic question.

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