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Applied Materials Technical Writer Interview Questions and Answers
Applied Materials Technical Writer Interview Experiences
2 interviews found
Shashwatee p
Selected
I applied via Approached by Company and was interviewed before Aug 2022. There were 2 interview rounds.
(2 Questions)
- Q1. Role discussion and semiconductor based subject matter discussion
- Q2. What is DDLC process ?
- Ans.
DDLC process stands for Design, Develop, Launch, and Control process used in technical writing.
DDLC process involves designing the document structure and content.
Developing the document by writing, editing, and formatting the content.
Launching the document by publishing or distributing it to the intended audience.
Controlling the document by updating, revising, and maintaining it as needed.
Interview Preparation Tips
Interview Questionnaire
3 Questions
- Q1. What were your roles and responsibiloties and how did you carried it out in ypir previous company ?
- Ans.
As a Technical Writer in my previous company, my roles and responsibilities included creating and editing technical documentation, collaborating with subject matter experts, and ensuring accuracy and clarity in the content.
Created and edited technical documentation such as user manuals, installation guides, and API documentation.
Collaborated with subject matter experts to gather information and understand complex techn...
- Q2. What are the products and Bisi ess units, you dealt with in your previois company ?
- Ans.
I dealt with various software products and business units in my previous company.
I worked on documentation for enterprise resource planning (ERP) software
I also created user manuals for customer relationship management (CRM) software
I collaborated with the marketing team to create product brochures and datasheets
I worked with the sales team to create proposals and presentations
I also created internal documentation for ...
- Q3. Can you show us your sample work in your previous company?
- Ans.
Yes, I can show you my sample work in my previous company.
I have a portfolio of technical writing samples that I can provide.
I can show you user manuals, online help documentation, and instructional guides that I have created.
I can also share examples of my work in creating API documentation and release notes.
Additionally, I have experience in writing white papers and case studies.
I can provide samples of my work in va...
Interview Preparation Tips
If the interview is too easy to select you must ask for the project duration in written for your secirity, else if your work is over, they can send you off anytime.
Top trending discussions
Interview questions from similar companies
I applied via LinkedIn and was interviewed in Feb 2024. There were 2 interview rounds.
Question on SDLC and challenges in Documentation process.
Writing test to check DITA proficiency on Framemaker/Oxygen
Write an email to inform release manager why you skipped a mapper release update in documentation
Basic grammar test
Interview with team members and Manger about writing style and documentation
I applied via Referral and was interviewed before Jan 2021. There were 5 interview rounds.
Interview Questionnaire
2 Questions
- Q1. Basic data structures questions from bit manipulation, trees, arrays, string
- Q2. Questions related to previous company work.
Interview Preparation Tips
Selected
I appeared for an interview before Feb 2023.
Practice on hackerrank, they send hackerrank link for screening round.
(1 Question)
- Q1. C, os, embedded questions
(1 Question)
- Q1. C, data structures,os
(1 Question)
- Q1. Previous jobs, salary discussion, relocation
Interview Preparation Tips
Gaurav Kumar
Selected
I applied via Referral and was interviewed in Sep 2023. There were 4 interview rounds.
(2 Questions)
- Q1. Find the length of longest common subsequence in given strings.
- Ans.
The length of the longest common subsequence in given strings is found using dynamic programming.
Use dynamic programming to find the length of the longest common subsequence.
Compare characters of the strings and build a matrix to store the lengths of common subsequences.
Traverse the matrix to find the length of the longest common subsequence.
- Q2. A basic DFS based graph question.
Write the algorithm for topological sorting.
(2 Questions)
- Q1. Basic system design questions.
- Q2. Explain CAP theorem.
- Ans.
CAP theorem states that in a distributed system, it is impossible to simultaneously guarantee consistency, availability, and partition tolerance.
Consistency: All nodes in the system have the same data at the same time.
Availability: Every request gets a response, even if some nodes are down.
Partition Tolerance: The system continues to operate despite network partitions.
In a distributed system, you can only achieve two o...
(1 Question)
- Q1. Explain your previous projects .
Skills evaluated in this interview
(2 Questions)
- Q1. What is VLSI design cycle ?
- Ans.
VLSI design cycle is the process of creating integrated circuits by going through various stages from design to fabrication.
VLSI design cycle involves stages like specification, design, verification, synthesis, and fabrication.
It starts with defining the requirements and specifications of the integrated circuit.
Design phase includes logic design, circuit design, and physical design.
Verification ensures that the design ...
- Q2. FIFO Pipeline depth calculation
(1 Question)
- Q1. Verilog code debug question
Interview Preparation Tips
Skills evaluated in this interview
I applied via Approached by Company and was interviewed in Feb 2022. There was 1 interview round.
(1 Question)
- Q1. Modem related like Tx power LNA camping issues debug Few data scenarios
Interview Preparation Tips
I applied via Naukri.com and was interviewed in Sep 2021. There were 3 interview rounds.
Interview Questionnaire
2 Questions
- Q1. String Reversal
- Q2. Bit manipulation
Interview Preparation Tips
I applied via Naukri.com and was interviewed in May 2021. There were 3 interview rounds.
Interview Questionnaire
1 Question
- Q1. Embedded software and hardware
Interview Preparation Tips
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Applied Materials Technical Writer Interview Process
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