Assistant Engineer Process

Assistant Engineer Process Interview Questions and Answers

Updated 31 Dec 2024

Q1. What is heat ? Types of heat transfer?

Ans.

Heat is a form of energy that is transferred from one body to another as a result of a difference in temperature.

  • Heat can be transferred through conduction, convection, and radiation.

  • Conduction is the transfer of heat through a material without any movement of the material itself. Example: Touching a hot stove.

  • Convection is the transfer of heat through the movement of fluids or gases. Example: Boiling water.

  • Radiation is the transfer of heat through electromagnetic waves. Exam...read more

Q2. What is cement ? Types of cement?

Ans.

Cement is a binding material used in construction. There are various types of cement available for different purposes.

  • Cement is made by heating limestone and clay in a kiln.

  • Portland cement is the most common type of cement used in construction.

  • Other types of cement include white cement, rapid hardening cement, and low heat cement.

  • Each type of cement has different properties and is used for specific applications.

  • For example, white cement is used for decorative purposes, while ...read more

Q3. How to control tombstone issue and missing issue

Ans.

Tombstone and missing issue can be controlled by implementing proper process controls and regular monitoring.

  • Implement strict process controls to ensure all steps are followed correctly

  • Regularly monitor production line for any signs of tombstone or missing issues

  • Train employees on proper procedures and quality standards

  • Utilize quality control tools such as checklists and inspections

  • Address any issues immediately to prevent recurrence

Q4. What is pwi of reflow profile

Ans.

PWI in reflow profile refers to the time between the start of preheat and the start of reflow soldering.

  • PWI stands for Preheat to Wave Intersection

  • It is a critical parameter in reflow soldering process

  • PWI is the time interval between the start of preheat and the start of reflow soldering

  • It ensures proper heating of the components before the solder paste melts

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Q5. What is 5W1H related defect

Ans.

5W1H related defect refers to identifying and addressing the Who, What, When, Where, Why, and How of a defect in a process.

  • Identifying the person responsible for the defect (Who)

  • Determining the nature of the defect (What)

  • Establishing when the defect occurred (When)

  • Locating where the defect took place (Where)

  • Understanding the reasons behind the defect (Why)

  • Analyzing how the defect happened (How)

Q6. What is SPC about spi

Ans.

SPC (Statistical Process Control) is about monitoring and controlling a process to ensure it operates efficiently and produces quality products.

  • SPC involves collecting and analyzing data to identify variations in a process.

  • It helps in detecting and correcting any issues before they result in defects.

  • Common tools used in SPC include control charts, histograms, and Pareto charts.

  • Example: Using control charts to monitor the temperature in a manufacturing process to ensure consis...read more

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Q7. What is whywhy analysis

Ans.

Whywhy analysis is a problem-solving technique that involves asking 'why' multiple times to get to the root cause of an issue.

  • Whywhy analysis is a technique used in process improvement to identify the root cause of a problem by asking 'why' repeatedly.

  • It helps in uncovering underlying issues that may not be immediately apparent.

  • By asking 'why' multiple times, the analysis aims to address the fundamental cause rather than just the symptoms.

  • Example: If a machine breaks down, as...read more

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