ENGINEER, ASSY EQUIPMENT & PROCESS

You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC methodology.
Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives..
Responsibilities And Tasks.
Evaluate and Improve processes, Materials, and/or Equipment Maintain in-depth process knowledge.
Maintain materials and equipment knowledge as it relates to the process and how they interact.
Optimize process and/or equipment variables by apply DOE techniques.
Maintain knowledge of material attributes (shelf life, storage requirements, etc.).
Define process edges and center the process (CPK).
Determine root cause and implement corrective actions.
Define and maintain operation procedures.
Requirements.
Bachelor's orMasters degreeor PhD in Electronic, Mechanical, Mechatronic or related Engineering.
Min5 years related experience in Assembly packaging or Semiconductor manufacturing background.
Possess good knowledge in Die Attach Processes.
Familiar with Failure Mode Effects Analysis(FMEA), Statistical Process Control (SPC) and Problem solving skills.
Knowledge inDesign Of Experiment (DOE) will be an added advantage.
Self-motivated, possess initiative and ability to work independently.
Team player with good communication and interpersonal skills.