This role is for a Process Data Simulation (PDS) Intern within Package Development Engineering (PDE) team. PDE PDS has been Center of Excellence (COE) for digital twins for backend process simulations. The team develops validated simulation methodologies and Digital Twins to help in cycle time reduction and quality/yield improvements.
Roles & responsibilities can include but are not limited to:
Structural analysis using Finite Element Methods or hand calculations of the various processes involved in semiconductor packaging for predicting and enhancing the performance.
Guide test vehicle development to improve simulation correlation to empirical data. Develop test plan wherever necessary to verify the simulation models and validate analysis approach in correlation with test outcomes.
Participates in development of simulation modeling methodologies in Structural, Thermal, Thermo-Structural and Multiphysics domain.
Solid knowledge through coursework, or experience in solid mechanics, structural dynamics, finite element methods.
Ability to draw free body diagrams and perform hand calculations.
Knowledge through coursework on modeling non linearities, material properties and material property test methods
Knowledge of one or more software s like Ansys/ Abaqus/ COMSOL is a plus
Strong oral and written communication skills.
Education Requirement & eligibility:
Students pursuing B.Tech in Mechanical Engg/ Materials Science & Engg / Applied Mechanics / Physis