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I was interviewed before Apr 2023.
Seeking new challenges and opportunities for growth.
Desire for new challenges and opportunities
Lack of career advancement in previous role
Seeking a more innovative and dynamic work environment
I am motivated to join your organization because of your reputation for innovation and commitment to excellence in electroplating.
I am impressed by the cutting-edge technology and processes used in your facility.
I am excited about the opportunity to work with a team of skilled professionals who share my passion for electroplating.
I believe that your organization's focus on quality and continuous improvement aligns with
The electroplating process involves depositing a thin layer of metal onto a conductive surface using an electric current.
Cleaning the substrate to remove any dirt or oils
Applying a conductive coating if necessary
Immersion in an electrolyte solution containing metal ions
Passing an electric current through the solution to deposit metal onto the substrate
Rinsing and drying the plated part
I utilize a variety of plating processes such as electroless nickel plating, gold plating, and chrome plating on parts.
Electroless nickel plating
Gold plating
Chrome plating
Coating is a general term for applying a layer of material on a surface, while electroplating specifically refers to using an electric current to deposit a thin layer of metal onto a conductive object.
Coating can refer to various methods such as painting, spraying, or dipping, while electroplating is a specific process that involves using electricity to deposit metal ions onto a substrate.
Electroplating provides a more...
CD stands for compact disc, a digital optical disc data storage format.
CD is a type of optical disc used for storing digital data.
It was originally developed for storing and playing back audio recordings.
CDs can also be used for storing other types of data such as software, documents, and images.
Common types of CDs include CD-ROM, CD-R, and CD-RW.
The current for plating parts is determined based on the surface area of the parts, desired plating thickness, and the type of metal being plated.
Calculate the surface area of the parts to be plated
Determine the desired plating thickness
Consider the type of metal being plated and its specific plating requirements
Use Faraday's law of electrolysis to calculate the current needed for the plating process
I utilize various types of chemistry in my work, including electrochemistry, inorganic chemistry, and surface chemistry.
Electrochemistry: Understanding the principles of electroplating and electrochemical reactions.
Inorganic chemistry: Knowledge of metal salts and their properties for plating processes.
Surface chemistry: Understanding the interactions between the substrate and plating solution for adhesion and quality.
...
Common defects in electroplating processes include blistering, peeling, and pitting.
Blistering can occur due to inadequate cleaning of the substrate before plating.
Peeling may result from poor adhesion between the substrate and the plated layer.
Pitting can be caused by impurities in the plating solution or improper current distribution.
Solutions include improving cleaning processes, optimizing adhesion promoters, and m...
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I applied via Referral and was interviewed before Oct 2023. There was 1 interview round.
I manage my workload by prioritizing tasks, delegating when necessary, and utilizing time management techniques.
Prioritize tasks based on deadlines and importance
Delegate tasks to team members to ensure efficiency
Use time management techniques such as setting goals and creating schedules
Regularly review and adjust workload to stay on track
Communicate with team members and supervisors to ensure alignment on priorities
Yes, I am willing to take on additional tasks to help others during busy schedules.
I believe in teamwork and helping each other out when needed
I am organized and efficient in managing my time to handle multiple tasks
I have experience in delegating responsibilities and coordinating with team members to ensure tasks are completed on time
I applied via Referral and was interviewed before Jun 2021. There were 2 interview rounds.
Name mangling is a technique used by compilers to give unique names to functions and variables to avoid naming conflicts.
Name mangling is used in C++ to support function overloading.
It is also used in Python to avoid naming conflicts in modules.
Name mangling can make it difficult to access variables and functions from outside the class in which they are defined.
In C++, name mangling can be seen by using the 'nm' comman
I applied via Recruitment Consultant and was interviewed before Aug 2020. There was 1 interview round.
I applied via Referral and was interviewed before Mar 2021. There were 3 interview rounds.
I applied via Naukri.com and was interviewed before Feb 2021. There were 2 interview rounds.
posted on 10 Sep 2017
I was interviewed before Sep 2016.
Some of the top questions asked at the Technico Industries Electro Plating Engineer interview -
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