Upload Button Icon Add office photos

Technico Industries

Compare button icon Compare button icon Compare

Filter interviews by

Clear (1)

Technico Industries Electro Plating Engineer Interview Questions, Process, and Tips

Updated 1 Feb 2025

Technico Industries Electro Plating Engineer Interview Experiences

1 interview found

Interview experience
1
Bad
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I was interviewed before Apr 2023.

Round 1 - Technical 

(9 Questions)

  • Q1. What are the reasons for your decision to leave your previous job?
  • Ans. 

    Seeking new challenges and opportunities for growth.

    • Desire for new challenges and opportunities

    • Lack of career advancement in previous role

    • Seeking a more innovative and dynamic work environment

  • Answered by AI
  • Q2. What motivates you to join our organization?
  • Ans. 

    I am motivated to join your organization because of your reputation for innovation and commitment to excellence in electroplating.

    • I am impressed by the cutting-edge technology and processes used in your facility.

    • I am excited about the opportunity to work with a team of skilled professionals who share my passion for electroplating.

    • I believe that your organization's focus on quality and continuous improvement aligns with

  • Answered by AI
  • Q3. What is the electroplating process that you follow?
  • Ans. 

    The electroplating process involves depositing a thin layer of metal onto a conductive surface using an electric current.

    • Cleaning the substrate to remove any dirt or oils

    • Applying a conductive coating if necessary

    • Immersion in an electrolyte solution containing metal ions

    • Passing an electric current through the solution to deposit metal onto the substrate

    • Rinsing and drying the plated part

  • Answered by AI
  • Q4. What types of plating processes do you utilize on parts?
  • Ans. 

    I utilize a variety of plating processes such as electroless nickel plating, gold plating, and chrome plating on parts.

    • Electroless nickel plating

    • Gold plating

    • Chrome plating

  • Answered by AI
  • Q5. What is the difference between coating and electroplating?
  • Ans. 

    Coating is a general term for applying a layer of material on a surface, while electroplating specifically refers to using an electric current to deposit a thin layer of metal onto a conductive object.

    • Coating can refer to various methods such as painting, spraying, or dipping, while electroplating is a specific process that involves using electricity to deposit metal ions onto a substrate.

    • Electroplating provides a more...

  • Answered by AI
  • Q6. What is CD.
  • Ans. 

    CD stands for compact disc, a digital optical disc data storage format.

    • CD is a type of optical disc used for storing digital data.

    • It was originally developed for storing and playing back audio recordings.

    • CDs can also be used for storing other types of data such as software, documents, and images.

    • Common types of CDs include CD-ROM, CD-R, and CD-RW.

  • Answered by AI
  • Q7. How do you determine the current for plating parts?
  • Ans. 

    The current for plating parts is determined based on the surface area of the parts, desired plating thickness, and the type of metal being plated.

    • Calculate the surface area of the parts to be plated

    • Determine the desired plating thickness

    • Consider the type of metal being plated and its specific plating requirements

    • Use Faraday's law of electrolysis to calculate the current needed for the plating process

  • Answered by AI
  • Q8. What types of chemistry do you utilize in your work?
  • Ans. 

    I utilize various types of chemistry in my work, including electrochemistry, inorganic chemistry, and surface chemistry.

    • Electrochemistry: Understanding the principles of electroplating and electrochemical reactions.

    • Inorganic chemistry: Knowledge of metal salts and their properties for plating processes.

    • Surface chemistry: Understanding the interactions between the substrate and plating solution for adhesion and quality.

    • ...

  • Answered by AI
  • Q9. What types of defects occur in your process, and what are the solutions to address them?
  • Ans. 

    Common defects in electroplating processes include blistering, peeling, and pitting.

    • Blistering can occur due to inadequate cleaning of the substrate before plating.

    • Peeling may result from poor adhesion between the substrate and the plated layer.

    • Pitting can be caused by impurities in the plating solution or improper current distribution.

    • Solutions include improving cleaning processes, optimizing adhesion promoters, and m...

  • Answered by AI

Interview questions from similar companies

Interview experience
3
Average
Difficulty level
Moderate
Process Duration
More than 8 weeks
Result
Selected Selected

I applied via Referral and was interviewed before Oct 2023. There was 1 interview round.

Round 1 - HR 

(2 Questions)

  • Q1. How do u manage work load
  • Ans. 

    I manage my workload by prioritizing tasks, delegating when necessary, and utilizing time management techniques.

    • Prioritize tasks based on deadlines and importance

    • Delegate tasks to team members to ensure efficiency

    • Use time management techniques such as setting goals and creating schedules

    • Regularly review and adjust workload to stay on track

    • Communicate with team members and supervisors to ensure alignment on priorities

  • Answered by AI
  • Q2. Will you take others activity while busy schedule
  • Ans. 

    Yes, I am willing to take on additional tasks to help others during busy schedules.

    • I believe in teamwork and helping each other out when needed

    • I am organized and efficient in managing my time to handle multiple tasks

    • I have experience in delegating responsibilities and coordinating with team members to ensure tasks are completed on time

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Opt this with caution

I applied via Referral and was interviewed before Jun 2021. There were 2 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all Resume tips
Round 2 - One-on-one 

(1 Question)

  • Q1. Situation Based Basic formulas rolls and responsibilities

Interview Preparation Tips

Interview preparation tips for other job seekers - Great leadership team to work with, Good learning,

Interview Questionnaire 

1 Question

  • Q1. What is name mangling?
  • Ans. 

    Name mangling is a technique used by compilers to give unique names to functions and variables to avoid naming conflicts.

    • Name mangling is used in C++ to support function overloading.

    • It is also used in Python to avoid naming conflicts in modules.

    • Name mangling can make it difficult to access variables and functions from outside the class in which they are defined.

    • In C++, name mangling can be seen by using the 'nm' comman

  • Answered by AI

Skills evaluated in this interview

I applied via Recruitment Consultant and was interviewed before Aug 2020. There was 1 interview round.

Interview Questionnaire 

1 Question

  • Q1. Technical questions on inventory procees

Interview Preparation Tips

Interview preparation tips for other job seekers - As I already worked in inventory team in previous company, was able to answer all technical questions.

I applied via Referral and was interviewed before Mar 2021. There were 3 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all Resume tips
Round 2 - HR 

(3 Questions)

  • Q1. What are your salary expectations?
  • Q2. Share details of your previous job.
  • Q3. Why are you looking for a change?
Round 3 - Technical 

(1 Question)

  • Q1. About process and total experience

Interview Preparation Tips

Interview preparation tips for other job seekers - Be attentive. Always provide answer to the point. Explain your full experience in good and accurate manner. You need to provide full and constrictive information about your process/operation knowledge

I applied via Naukri.com and was interviewed before Feb 2021. There were 2 interview rounds.

Round 1 - Technical 

(1 Question)

  • Q1. Details of LOI, articles of UCP, scope of ISBP
Round 2 - HR 

(2 Questions)

  • Q1. What are your salary expectations?
  • Q2. Share details of your previous job.

Interview Preparation Tips

Interview preparation tips for other job seekers - Be well prepared about UCP articles and have a good overview on ISBP.

Interview Questionnaire 

1 Question

  • Q1. About the work experience

Interview Questionnaire 

1 Question

  • Q1. Technical questions related to inventory,scm and stock management

Interview Preparation Tips

Round: Resume Shortlist
Experience: Experience and key skills

I was interviewed before Sep 2016.

Interview Questionnaire 

1 Question

  • Q1. Ocampo, basic electronics and C

Interview Preparation Tips

Round: Test
Duration: 1 hour
Total Questions: 50

Skills: Embedded Systems, C Programming
College Name: Sahyadri college of engineering
Contribute & help others!
anonymous
You can choose to be anonymous

Technico Industries Interview FAQs

How many rounds are there in Technico Industries Electro Plating Engineer interview?
Technico Industries interview process usually has 1 rounds. The most common rounds in the Technico Industries interview process are Technical.
What are the top questions asked in Technico Industries Electro Plating Engineer interview?

Some of the top questions asked at the Technico Industries Electro Plating Engineer interview -

  1. What types of defects occur in your process, and what are the solutions to addr...read more
  2. What is the electroplating process that you foll...read more
  3. What types of plating processes do you utilize on par...read more

Recently Viewed

INTERVIEWS

Athenahealth Technology

No Interviews

SALARIES

LTIMindtree

SALARIES

HCLTech

DESIGNATION

SALARIES

LTIMindtree

JOBS

Choice Equity Broking

No Jobs

JOBS

UKG

No Jobs

SALARIES

UKG

SALARIES

L&T Technology Services

DESIGNATION

Tell us how to improve this page.

Technico Industries Electro Plating Engineer Interview Process

based on 1 interview

Interview experience

1
  
Bad
View more

Interview Questions from Similar Companies

TCS Interview Questions
3.7
 • 10.4k Interviews
Infosys Interview Questions
3.6
 • 7.6k Interviews
Wipro Interview Questions
3.7
 • 5.6k Interviews
Tata Group Interview Questions
4.2
 • 358 Interviews
Adani Group Interview Questions
3.9
 • 187 Interviews
View all
Assistant Manager
148 salaries
unlock blur

₹0 L/yr - ₹0 L/yr

Engineer
104 salaries
unlock blur

₹0 L/yr - ₹0 L/yr

Senior Engineer
97 salaries
unlock blur

₹0 L/yr - ₹0 L/yr

Quality Engineer
53 salaries
unlock blur

₹0 L/yr - ₹0 L/yr

Production Engineer
50 salaries
unlock blur

₹0 L/yr - ₹0 L/yr

Explore more salaries
Compare Technico Industries with

Tata Group

4.2
Compare

Reliance Industries

4.0
Compare

Bharat Forge

3.9
Compare

Mahindra & Mahindra

4.1
Compare
Did you find this page helpful?
Yes No
write
Share an Interview