Expli spi and reflow temprature zones

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SPI and reflow temperature zones are important in SMT engineering.

SPI (Solder Paste Inspection) is a process used to inspect the quality of solder paste before reflow.
Reflow temperature zones refer to different temperature stages during the solder reflow process.
Typically, reflow temperature zones include preheat, soak, reflow, and cooling zones.
Each zone has a specific temperature profile to ensure proper soldering and component reliability.
SPI helps to identify defects like insufficient or excessive solder paste, misalignment, bridging, etc.
Reflow temperature zones are critical for achieving proper solder joint formation and avoiding thermal stress.
Monitoring and controlling temperature profiles in both SPI and reflow processes are essential for high-quality SMT assembly.

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