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Lam Research Graduate Engineer Interview Questions and Answers

Updated 5 Mar 2024

Lam Research Graduate Engineer Interview Experiences

1 interview found

Interview experience
3
Average
Difficulty level
-
Process Duration
-
Result
Not Selected
Round 1 - Technical 

(1 Question)

  • Q1. What is the application of thermal boundary layer
  • Ans. 

    The thermal boundary layer is a thin layer of fluid near a solid surface where heat transfer occurs mainly by conduction.

    • It is important in heat transfer analysis and design of cooling systems.

    • Helps in understanding the temperature distribution near a solid surface.

    • Used in designing heat exchangers, cooling fins, and other thermal management systems.

  • Answered by AI

Interview questions from similar companies

I applied via Referral and was interviewed before Jan 2021. There were 5 interview rounds.

Interview Questionnaire 

2 Questions

  • Q1. Basic data structures questions from bit manipulation, trees, arrays, string
  • Q2. Questions related to previous company work.

Interview Preparation Tips

Interview preparation tips for other job seekers - don't try to elaborate the answer be precise and clear about your answers.
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I appeared for an interview before Feb 2023.

Round 1 - Coding Test 

Practice on hackerrank, they send hackerrank link for screening round.

Round 2 - Technical 

(1 Question)

  • Q1. C, os, embedded questions
Round 3 - Technical 

(1 Question)

  • Q1. C, data structures,os
Round 4 - HR 

(1 Question)

  • Q1. Previous jobs, salary discussion, relocation

Interview Preparation Tips

Interview preparation tips for other job seekers - Practice basic, logical, coding questions for embedded interviews ex. Simple Data structures, bit manipulation etc
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
2-4 weeks
Result
Selected Selected

I applied via Referral and was interviewed in Sep 2023. There were 4 interview rounds.

Round 1 - Technical 

(2 Questions)

  • Q1. Find the length of longest common subsequence in given strings.
  • Ans. 

    The length of the longest common subsequence in given strings is found using dynamic programming.

    • Use dynamic programming to find the length of the longest common subsequence.

    • Compare characters of the strings and build a matrix to store the lengths of common subsequences.

    • Traverse the matrix to find the length of the longest common subsequence.

  • Answered by AI
  • Q2. A basic DFS based graph question.
Round 2 - Coding Test 

Write the algorithm for topological sorting.

Round 3 - Technical 

(2 Questions)

  • Q1. Basic system design questions.
  • Q2. Explain CAP theorem.
  • Ans. 

    CAP theorem states that in a distributed system, it is impossible to simultaneously guarantee consistency, availability, and partition tolerance.

    • Consistency: All nodes in the system have the same data at the same time.

    • Availability: Every request gets a response, even if some nodes are down.

    • Partition Tolerance: The system continues to operate despite network partitions.

    • In a distributed system, you can only achieve two o...

  • Answered by AI
Round 4 - HR 

(1 Question)

  • Q1. Explain your previous projects .

Skills evaluated in this interview

Interview experience
3
Average
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Technical 

(2 Questions)

  • Q1. What is VLSI design cycle ?
  • Ans. 

    VLSI design cycle is the process of creating integrated circuits by going through various stages from design to fabrication.

    • VLSI design cycle involves stages like specification, design, verification, synthesis, and fabrication.

    • It starts with defining the requirements and specifications of the integrated circuit.

    • Design phase includes logic design, circuit design, and physical design.

    • Verification ensures that the design ...

  • Answered by AI
  • Q2. FIFO Pipeline depth calculation
Round 2 - Technical 

(1 Question)

  • Q1. Verilog code debug question

Interview Preparation Tips

Interview preparation tips for other job seekers - Do read job JD and prepare accordingly

Skills evaluated in this interview

I applied via Approached by Company and was interviewed in Feb 2022. There was 1 interview round.

Round 1 - One-on-one 

(1 Question)

  • Q1. Modem related like Tx power LNA camping issues debug Few data scenarios

Interview Preparation Tips

Interview preparation tips for other job seekers - Power related and thermal related

I applied via Naukri.com and was interviewed in Sep 2021. There were 3 interview rounds.

Interview Questionnaire 

2 Questions

  • Q1. String Reversal
  • Q2. Bit manipulation

Interview Preparation Tips

Interview preparation tips for other job seekers - The initial coding round with hackerrank was a bit difficult. The interview was fairly easy with some C questions on string operations and bitwise operations. Ending with some logical questions you would find on any tech interview portal

I applied via Naukri.com and was interviewed in May 2021. There were 3 interview rounds.

Interview Questionnaire 

1 Question

  • Q1. Embedded software and hardware

Interview Preparation Tips

Interview preparation tips for other job seekers -

I applied via Company Website and was interviewed in Oct 2021. There were 4 interview rounds.

Interview Questionnaire 

5 Questions

  • Q1. Data structures
  • Q2. Os theory related questions
  • Q3. White board coding
  • Q4. Memory manger design
  • Q5. Virtual memory concepts

Interview Preparation Tips

Interview preparation tips for other job seekers - Prepare well on data structures
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
2-4 weeks
Result
Selected Selected

I appeared for an interview in Mar 2024.

Round 1 - Coding Test 

1. Reverse a singly linked list
2. Kadane Algorithm

Round 2 - One-on-one 

(1 Question)

  • Q1. Asked about my previous company and projects I worked on. In depth discussion on my resume. Questions on OS fundamentals.
Round 3 - One-on-one 

(1 Question)

  • Q1. In depth discussion on the projects I previously worked on. Write code to explain race condition in OS. Few puzzles and numerical were given to test my analytical skills.
Round 4 - One-on-one 

(1 Question)

  • Q1. Final Round with Senior Manager, testing me on all parameters aptitude, tech stack, past experience and interest in the role.

Interview Preparation Tips

Interview preparation tips for other job seekers - Prepare well to face any questions from your resume/cv
Prepare DSA, os fundamentals(mutex, semaphore, deadlock, memory management, etc)

Lam Research Interview FAQs

How many rounds are there in Lam Research Graduate Engineer interview?
Lam Research interview process usually has 1 rounds. The most common rounds in the Lam Research interview process are Technical.

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Lam Research Graduate Engineer Interview Process

based on 1 interview

Interview experience

3
  
Average
View more

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