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Senior Staff Signal Integrity Engineer
3-7 years
Bangalore / Bengaluru
1 vacancy
Senior Staff Signal Integrity Engineer
MaxLinear
posted 2mon ago
Job Role Insights
Flexible timing
Key skills for the job
Job Description
MaxLinear is seeking a Senior Staff Signal Integrity Engineer to join our growing team. We have a culture that thrives on innovation and allows you to learn, teach and grow while contributing to the success of our products and company. In this position, you will focus on the following:
- Responsible for design and simulation of state-of-the-art packages and boards for advanced communications SoCs as well as high-speed products
- Work cross-functionally with IC designers, Layout engineers, board designers, thermal engineers and test/characterization team to plan and architect the power delivery and Signal integrity needs of packages and PCBs for MaxLinear s next generation products
- You will work on a diverse set of applications ranging from Wireless/RF, 5G communications, power amplifiers, wired optical communications for 400G/800G involving NRZ, PAM4 and storage market, targeted for Datacenters, AI, and machine learning
- Experience designing and simulating signal and power integrity solutions for high speed system components (packages, PCB, connectors etc )
- Strong understanding of Electromagnetic fundamentals and transmission line theory
- Be able to navigate in layout tools such as Allegro and APD used for PCB and Package design and be able to update the design for minor changes and optimizations
- High speed channel simulations for SerDes and transient simulation for SI and PI
- Detailed understanding of s-parameters, Smith Chart and frequency domain analysis
- Strong working knowledge of HFSS, SiWave, PowerSI or similar field solvers for generating electrical models from package and PCB layouts
- Self-motivated, excellent communication skills, and ability to excel in a fast-paced environment
- Understanding of different IEEE and Optical standards to define design guidelines
- Experience with electro-optic integration on packages; co-packaging of DC-DC convertors, regulator, TIAs or optical drivers. Multi-chip package design
- Good familiarity with IC design flows, floor-planning, IO ring design, on-chip decoupling, and have used tools such as Totem for on-die EM/IR analysis
- Understanding of different TX/RX circuit designs and how system SI/PI impacts such circuits. Use this knowledge to drive the design of packages and PCBs
- Expertise in equalization techniques such as FIR, CTLE, DFE, FFE and different types of noise in the system and channels and how to optimize EQ settings to mitigate them
- Hands-on experience with Oscilloscope, Spectrum Analyzer, and VNA
- Expertise in HSPICE, SPECTRE and ADS and be able to run time and frequency domain simulations for PDN analysis; use AMI models for channel simulations
- Masters or PhD in Electrical Engineering with at least 8+ years of SI/PI experience
Employment Type: Full Time, Permanent
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Flexible timing
Monday to Friday
No travel
Day Shift
MaxLinear Benefits
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