Senior System-in-Package (SiP) Design Engineer

Company Overview: izmo Microsystems Pvt. Ltd. is a pioneering semiconductor and systems company specializing in System-in-Package (SiP) miniaturization. With state-of-the-art facilities in Bangalore, we offer advanced 3D packaging solutions to meet the demands of high-density, high-performance systems across various industries, including consumer electronics, automotive, telecommunications, and green energy.

Position Overview: We are seeking an experienced Senior System-in-Package Engineer to lead the design and development of innovative SiP solutions. The ideal candidate will have a strong background in advanced packaging technologies and a proven track record of delivering high-performance SiP designs from concept to production.

Key Responsibilities:

• Lead the design and layout of complex SiP solutions, including FCBGA and FCCSP packages, from initial concept through to tape-out.
• Collaborate with cross-functional teams, including digital designers, SI/PI engineers, and manufacturing teams, to define package requirements and ensure design integrity.
• Develop and optimize package layer stack-ups, padstacks, and design constraints to meet electrical and mechanical performance targets.
• Conduct feasibility studies, including fan-out analysis, mock-up designs, and package size reduction initiatives.
• Perform design rule checks (DRC), design verification, and ensure compliance with manufacturing and reliability standards.
• Drive continuous improvement in design methodologies and workflows, leveraging scripting and automation where applicable.

Basic Qualifications:

• Bachelors or Masters degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related field.
• Minimum of 5 years of experience with Cadence APD/SIP, with demonstrated ability to independently design and layout FCBGA/FCCSP packages.
• In-depth understanding of BGA package substrate technologies, assembly processes, and high-speed design principles.
• Familiarity with bill of materials (BOM), layer stack-ups, and design rules for high-speed applications.
• Working knowledge of package reliability, signal integrity (SI), and power integrity (PI) considerations.
• Strong problem-solving skills, with an entrepreneurial mindset and hands-on work ethic.
• Excellent teamwork and communication skills, with the ability to thrive in a dynamic, cross-functional environment.

Preferred Qualifications:

• Experience with multi-chip modules, interposers, 2.5D, or heterogeneous package designs.
• Proficiency in scripting languages for design automation and reporting.
• Understanding of transmission line theory and SI/PI fundamentals.

Why Join Us:

At izmo Microsystems, you'll be at the forefront of semiconductor packaging innovation, working in a cutting-edge facility equipped with advanced technologies such as 3D die stacking and fine-pitch wire bonding. We offer a collaborative environment where your expertise will contribute to the development of next-generation electronic devices.