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KLA Applications Engineer Interview Questions and Answers

Updated 14 Feb 2024

KLA Applications Engineer Interview Experiences

1 interview found

Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via Approached by Company and was interviewed in Jan 2024. There were 3 interview rounds.

Round 1 - HR 

(1 Question)

  • Q1. Tell me about yourself
Round 2 - Aptitude Test 

Simple aptitude questions were asked you can easily find it on internet

Round 3 - HR 

(2 Questions)

  • Q1. General questions regarding company work
  • Q2. Why should we hire you

Interview questions from similar companies

Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
No response

I applied via LinkedIn and was interviewed in Jul 2024. There was 1 interview round.

Round 1 - Technical 

(2 Questions)

  • Q1. DSA,bitwise operations
  • Q2. Gpu architecture

Interview Preparation Tips

Interview preparation tips for other job seekers - Prepare DSA,Bitwise operators, Parallel programming, Gpu architecture

I applied via Referral and was interviewed in Jun 2022. There were 2 interview rounds.

Round 1 - Aptitude Test 

Technical+apptitude round questions were tough in technical

Round 2 - Technical 

(2 Questions)

  • Q1. Mostly on filters block diagrams ,opamps,converters etc
  • Q2. What is physical significance of 2nd order on filtwrs
  • Ans. 

    Second order filters have steeper roll-off and better attenuation of higher frequencies.

    • Second order filters have a slope of -40 dB/decade.

    • They have a higher Q factor than first order filters.

    • They provide better attenuation of higher frequencies.

    • Examples include Butterworth, Chebyshev, and Bessel filters.

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Analog must be perfect they will jidge on your approach not answer
Interview experience
3
Average
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via Campus Placement and was interviewed in Dec 2022. There were 4 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all Resume tips
Round 2 - Aptitude Test 

Basic aptitude, but limited time.

Round 3 - Technical 

(3 Questions)

  • Q1. Semiconductor fabrication-related questions
  • Q2. Material characterization techniques
  • Ans. 

    Material characterization techniques involve analyzing the properties of materials to understand their composition and behavior.

    • Common techniques include X-ray diffraction, scanning electron microscopy, and Fourier transform infrared spectroscopy.

    • These techniques help determine material composition, crystal structure, surface morphology, and chemical bonding.

    • Other techniques like thermal analysis, mechanical testing, a...

  • Answered by AI
  • Q3. Company related questions
Round 4 - HR 

(1 Question)

  • Q1. Interest to travel, behavioral round questions.

I applied via Naukri.com and was interviewed in Dec 2021. There were 3 interview rounds.

Interview Questionnaire 

4 Questions

  • Q1. About Docker commands, postgres and kubernetes.
  • Q2. Commands like vaccum analyse.
  • Q3. Volumes in docker
  • Ans. 

    Volumes in Docker are used to persist data outside of containers.

    • Volumes can be created and managed using the `docker volume` command.

    • They can be mounted to containers using the `--mount` or `-v` flag.

    • Volumes can be shared between multiple containers.

    • They can also be backed up and restored easily.

    • Examples of using volumes include storing database data or configuration files.

  • Answered by AI
  • Q4. Kubernetes architecture

Interview Preparation Tips

Interview preparation tips for other job seekers - It was average kind of question

Skills evaluated in this interview

Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Technical 

(2 Questions)

  • Q1. FPGA architecture
  • Q2. Static Timing Analysis
Interview experience
4
Good
Difficulty level
Easy
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Company Website and was interviewed before Dec 2023. There were 4 interview rounds.

Round 1 - Technical 

(1 Question)

  • Q1. Digital related to ff,mux,waveform,fsm
Round 2 - Technical 

(1 Question)

  • Q1. Sta max frew ,setup and hold time , numerical questions
Round 3 - Technical 

(1 Question)

  • Q1. Fpga architecture,flow ,related to tool ,ram ,fifo
Round 4 - HR 

(1 Question)

  • Q1. Hr question,do you work for longer in this organisation,future goals, willing to relocate

I applied via Campus Placement and was interviewed in Sep 2021. There were 4 interview rounds.

Interview Questionnaire 

3 Questions

  • Q1. Mosfet basics
  • Q2. Setup, hold time
  • Q3. Verilog code for d-ff
  • Ans. 

    Verilog code for d-ff

    • Declare input and output ports

    • Use always block to implement the functionality

    • Use non-blocking assignment for output

    • Use blocking assignment for clock and reset

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - It consists of 2 round
1. Online test
2. Technical - HR round.
Focus on basics .
Digital electronics, Verilog hdl,STA.

Skills evaluated in this interview

Interview experience
4
Good
Difficulty level
Moderate
Process Duration
2-4 weeks
Result
Selected Selected

I applied via Referral and was interviewed in Apr 2024. There was 1 interview round.

Round 1 - Technical 

(5 Questions)

  • Q1. Focus on Basics of Digital electronics,verilog SV and UVM will be an advantage.Reasoning questions also plays a crucial role.Realizations of gates using and NAND and NOR gate,Realization of gates using mu...
  • Q2. Don't forget look your projects mentioned in your resume,They will directky ask you to write code,Ask lot of questions on projects,Communication skills willbe added advantage.
  • Q3. Reasonig questions:-9 ball's weight checking,horses question,a pond of flowers on which day they full if half fill in 10 days,3L 5L required water 4L,4 pin OTP generation probability with unique numbers,go...
  • Q4. Don't forget take a look on ypur projects whatever you mentioned in your resume everything matters,Basics of digital electronics,sv and UVM,More focus on practising coding,outputs for snippets plays a cruc...
  • Q5. One personal advantage for MNC's refferals matters alot,better to ask anyone in linkdin to reffer you.
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Approached by Company and was interviewed before Jun 2023. There was 1 interview round.

Round 1 - Technical 

(5 Questions)

  • Q1. PNR flow and questions related to each stage like floorplanning guidelines, how to do macro placement etc.
  • Q2. Challenges you faced in Placement stage, how did you resolve congestion in your design. How to improve timing.
  • Q3. CTS spec files, inverters or buffers which is preferable. Skew and latency related questions
  • Q4. Detailed discussion about crosstalk, antenna effects and Electromigration
  • Q5. Basic TCL scripts to write

Interview Preparation Tips

Interview preparation tips for other job seekers - Please have a good knowledge of ASIC flow and TCL scripting. Also explain properly about your past projects.
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KLA Interview FAQs

How many rounds are there in KLA Applications Engineer interview?
KLA interview process usually has 3 rounds. The most common rounds in the KLA interview process are HR and Aptitude Test.
How to prepare for KLA Applications Engineer interview?
Go through your CV in detail and study all the technologies mentioned in your CV. Prepare at least two technologies or languages in depth if you are appearing for a technical interview at KLA. The most common topics and skills that interviewers at KLA expect are Analytical skills, Application Development, Chip Design, Data Analysis and Fabrication.

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Interview experience

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