explain CMOS fabrication steps?

Question

Accepted Answer

CMOS fabrication involves multiple steps including wafer preparation, photolithography, etching, and doping.

The process starts with wafer preparation, where a silicon wafer is cleaned and polished.
Next, a layer of oxide is grown on the wafer surface.
Photolithography is then used to pattern the oxide layer with a photoresist material.
Etching is used to remove the oxide layer in the areas not covered by the photoresist.
Doping is used to introduce impurities into the silicon to create p-type and n-type regions.
Multiple layers of oxide, metal, and polysilicon are deposited and patterned to create the desired circuitry.
Finally, the wafer is cut into individual chips and packaged.

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