Work within the engineering team on designing new or improving designs of existing electron-beam imaging products for the semiconductor equipment market.
The product subsystems include light optics, electron optics, imaging, detectors, HV electronics, vacuum systems, wafer transfer systems, detection and classification algorithms, machine control and UI software.
The candidate is expected to gain a detailed functional understanding of the entire product, act independently, devise and drive innovative analyses and solutions for complex problems.
Activities will include development of new designs by specifying SW / Algo / HW requirements followed by characterization, product integration and maintenance.
Candidate is expected to be involved in remote and on-site customer support.
On-site customer support can be Fly and Fix to customer sites in Taiwan, Korea, Singapore, etc
For necessary training, candidate would be trained at our Singapore and US offices. The overall travel load is between 30 and 50%.
General Requirements
Candidate should have Doctorate/Masters degree in either of Physics, Engineering Physics, Engineering Design, Mechanical Engineering, Electrical Engineering or Materials and Metallurgical Engineering.
Knowledge in instrumentation, signal processing and optical/electro-optical systems such as electron microscopes is preferred.
Experience with Vacuum Systems, Electron Optics, and High Voltage for scanning electron microscopes or equivalent a plus.
Hands-on experiences in machine control and/or scientific data analysis is highly desired.
Candidate must have demonstrated an ability in setting-up experiments, modelling and data analysis, solving complex technical problems.
Candidate must have demonstrated proficiency in scripting language (MATLAB, Python, others) for scientific data collection & analysis.
Finally, the candidate must have excellent communication, interpersonal skills and ability to create effective technical presentations
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